<p>This paper presents a stepped-ring-assisted junction termination extension (SRA-JTE) structure that integrates high-concentration P<sup>+</sup> rings into a stepped-profile termination to enhance process tolerance for 6.5 kV SiC PiN diodes. Conventional JTE structures exhibit high sensitivity to process variations, particularly JTE dose fluctuations and fixed oxide charge (Q<sub>F</sub>), which compromise device reliability and performance consistency. The proposed SRA-JTE structure maintains stable breakdown performance across a JTE dose window of 1.5 × 10<sup>12</sup> to 4 × 10<sup>12</sup> cm<sup>−2</sup>. It demonstrates superior robustness with a coefficient of variation of 3.9% under varying Q<sub>F</sub> conditions (±1 × 10<sup>12</sup> cm<sup>−2</sup>), compared to 37.5% and 9.7% for conventional single-zone and stepped JTE structures, respectively. Experimental validation confirms close agreement between simulated and measured results under realistic Q<sub>F</sub> conditions of 0.5 × 10<sup>12</sup> cm<sup>−2</sup>. The enhanced process tolerance and stable electrical characteristics demonstrate the practical viability of the SRA-JTE design for reliable 6.5 kV class SiC PiN diode applications with improved device performance consistency.</p>

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Process-Robust Stepped-Ring-Assisted Junction Termination Extension Design for 6.5 kV SiC PiN Diodes

  • Subin Choi,
  • Ogyun Seok

摘要

This paper presents a stepped-ring-assisted junction termination extension (SRA-JTE) structure that integrates high-concentration P+ rings into a stepped-profile termination to enhance process tolerance for 6.5 kV SiC PiN diodes. Conventional JTE structures exhibit high sensitivity to process variations, particularly JTE dose fluctuations and fixed oxide charge (QF), which compromise device reliability and performance consistency. The proposed SRA-JTE structure maintains stable breakdown performance across a JTE dose window of 1.5 × 1012 to 4 × 1012 cm−2. It demonstrates superior robustness with a coefficient of variation of 3.9% under varying QF conditions (±1 × 1012 cm−2), compared to 37.5% and 9.7% for conventional single-zone and stepped JTE structures, respectively. Experimental validation confirms close agreement between simulated and measured results under realistic QF conditions of 0.5 × 1012 cm−2. The enhanced process tolerance and stable electrical characteristics demonstrate the practical viability of the SRA-JTE design for reliable 6.5 kV class SiC PiN diode applications with improved device performance consistency.