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<p>With the emergence of software-defined vehicles (SDVs), there is an increasing demand for automotive semiconductors with higher performance and reliability. To fulfill various design requirements, it is crucial to introduce techniques reducing design simulation time and finding optimal solutions. This paper presents a case study of utilizing AI-based surrogate models to accelerate the packaging design process.</p> Graphical abstract <p></p>

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Reduction in electronic package design processes through AI-based surrogate models

  • 期刊论文

  • 发表日期：

    2025年5月21日

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  • Jungeon Lee,
  • Daeil Kwon

摘要

With the emergence of software-defined vehicles (SDVs), there is an increasing demand for automotive semiconductors with higher performance and reliability. To fulfill various design requirements, it is crucial to introduce techniques reducing design simulation time and finding optimal solutions. This paper presents a case study of utilizing AI-based surrogate models to accelerate the packaging design process.

Graphical abstract