Multiband 3D printed baluns for high-frequency networks
摘要
This work examines the impact of the choice of manufacturing technique employed and the choice of material on the application of a squared dual-band balun. The balun is designed, simulated, and fabricated (on rigid and flexible substrates) using two additive manufacturing processes and a traditional process on a printed circuit board (PCB). The measured results from the different manufacturing processes are compared. The samples exhibit satisfactory impedance results across various bandwidths. The PCB design shows impressive performance, with a measured return loss better than -10 dB between the frequency ranges of 7.06–7.45 GHz, 10.22–10.99 GHz, 11.5–12.5 GHz, 13.6–14.5 GHz, 15.1–16.8 GHz, 17.5–19.1 GHz, 21.03–22.2 GHz, and 22.8–23.9 GHz. The screen-printed design demonstrates a measured bandwidth ranging between 0.54–0.67 GHz, 2.39–2.53 GHz, 3.06–3.19 GHz, 3.45–3.59, 13.1–14.6 GHz and 21.7–23.7 GHz. While the measured bandwidth for the aerosol jet printed design is between 0.56–0.72 GHz, 2.92–3.59 GHz, and 14.3–18.6 GHz. Additionally, across all designs, the baluns exhibit insertion losses ranging between 0.5 dB to 3 dB.