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Effect of Nonlocality and Internal Heat Source on an Initially Stressed Thermoelastic Medium Under MGL Model

  • Komal Yadav,
  • Devender Sheoran,
  • Monika Sangwan,
  • Kapil Kumar Kalkal

摘要

Purpose

The current manuscript is devoted to scrutinize the effects of nonlocal parameter, internal heat source, and initial stress on the interactions caused by a moving thermal load in a generalized thermoelastic solid half-space.

Methods

The medium is assumed to be initially stressed and has uniform temperature. The problem has been modeled by employing the modified Green–Lindsay theory to carry out the investigation.The governing equations are handled with an analytical–numerical technique based on normal mode. In this technique, one gets exact solution without any assumed restrictions on the field variables. The normal mode technique is applicable to a wide range of problems in thermodynamics and thermoelasticity.

Results and Conclusions

Expressions for displacement, stresses, and temperature in the physical domain are obtained. The problem is illustrated by computing the numerical values of the field variables for a copper like material. Comparisons of the physical quantities are shown in figures to study the effects of nonlocal parameter, internal heat source, initial stress, and velocity of the thermal load. Some particular cases of interest have also been inferred from the present problem.

Originality/Value

In this article, we have investigated the effects of nonlocal parameter, internal heat source, initial stress, and velocity of the thermal load on the thermoelastic medium. Although various investigations do exist to observe the disturbances in a thermoelastic medium under the effects of different parameters, but the work in its present form, i.e., the disturbances in a thermoelastic medium in the presence of initial stress, nonlocal effect, and internal heat source under modified Green–Lindsay model have not been studied till now. The present work is useful and valuable for the analysis of problems at nanoscale level involving moving heat source, initial stress, and elastic deformation.