Scholarlink

<p>With increasing demands for lightweight and reliable aerospace electronics, accurate fatigue life prediction of solder joints under severe thermal cycling is essential. This study presents a finite element framework for evaluating the thermo-mechanical behavior of Pb–Sn solder joints in PBGA packages. A hyperbolic sine creep model and CSED-based fatigue approach were integrated to capture both local and global damage effects. A dual-scale strategy was used—linking a two-ball local model with a 26-ball global model—through which a nonlinear scaling law was derived. This enabled extrapolation of global CSED from local results with less than 4% error and over 85% reduction in simulation time. Fatigue life was predicted based on maximum CSED to reflect edge-critical failure. Compared to linear extrapolation, the nonlinear method significantly enhanced accuracy, especially in high-cycle regimes. The approach provides a fast and physics-informed solution for early reliability screening of solder joint arrays in space electronics.</p>

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Energy-Based Nonlinear Scaling Methodology for Predicting Fatigue Life of PBGA Solder Balls under Cyclic Thermal Loading

  • 期刊论文

  • 发表日期：

    2025年8月26日

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  • Jaehyo Lee,
  • Young-Cheol Kim,
  • Sang-Woo Kim,
  • Hyun-Ung Oh

摘要

With increasing demands for lightweight and reliable aerospace electronics, accurate fatigue life prediction of solder joints under severe thermal cycling is essential. This study presents a finite element framework for evaluating the thermo-mechanical behavior of Pb–Sn solder joints in PBGA packages. A hyperbolic sine creep model and CSED-based fatigue approach were integrated to capture both local and global damage effects. A dual-scale strategy was used—linking a two-ball local model with a 26-ball global model—through which a nonlinear scaling law was derived. This enabled extrapolation of global CSED from local results with less than 4% error and over 85% reduction in simulation time. Fatigue life was predicted based on maximum CSED to reflect edge-critical failure. Compared to linear extrapolation, the nonlinear method significantly enhanced accuracy, especially in high-cycle regimes. The approach provides a fast and physics-informed solution for early reliability screening of solder joint arrays in space electronics.