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<p>The present investigation focuses on the development of sustainable polyvinyl alcohol (PVA) biocomposite films reinforced with <i>Madhuca longifolia</i> seed shell-derived biocarbon for multifunctional engineering applications. Biocarbon particles were synthesized through controlled pyrolysis at 500&#xa0;°C and subsequently surface modified using 3-aminopropyltrimethoxysilane (3-APTMS) to improve filler–matrix compatibility. Composite films containing 1, 3, 5, and 7 vol% silane-treated biocarbon were fabricated using the solution casting technique and characterized for mechanical, thermal conductivity, and dielectric properties. FTIR analysis confirmed successful silane functionalization through the formation of Si–O–C and Si–O–Si bonds on the biocarbon surface. Mechanical characterization revealed significant enhancement in tensile strength, tear resistance, and hardness with increasing biocarbon loading up to 5 vol% (MB2). The MB2 composite exhibited nearly 68.7% improvement in tensile strength, 72.2% enhancement in tear strength, and 30.6% increase in hardness compared with neat PVA. Thermal conductivity also improved considerably from 0.21&#xa0;W/m·K for neat PVA to 0.39&#xa0;W/m·K for MB2, corresponding to an enhancement of approximately 85.7%. Dielectric analysis demonstrated improved dielectric constant and dielectric loss behaviour due to enhanced interfacial polarization and conductive pathways introduced by the biocarbon reinforcement. The maximum dielectric constant of 3.2 was achieved for MB2, representing approximately 68.4% improvement over neat PVA. However, a slight reduction in properties was observed at 7 vol% loading because of filler agglomeration and microstructural discontinuities. Overall, the developed PVA/biocarbon biocomposite films demonstrated excellent multifunctional characteristics, indicating their strong potential for biodegradable packaging, thermal management systems, flexible electronic substrates, and lightweight dielectric applications.</p>

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Mechanical, Thermal conductivity and Dielectric Properties of Madhuca longifolia Seed Shell–Derived Biocarbon Reinforced PVA Biocomposite Films

  • 期刊论文

  • 发表日期：

    2026年6月15日

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  • R. Chandramohan,
  • M. Venkatesulu,
  • S. Yogeswari,
  • Shashi Prakash Dwivedi

摘要

The present investigation focuses on the development of sustainable polyvinyl alcohol (PVA) biocomposite films reinforced with Madhuca longifolia seed shell-derived biocarbon for multifunctional engineering applications. Biocarbon particles were synthesized through controlled pyrolysis at 500 °C and subsequently surface modified using 3-aminopropyltrimethoxysilane (3-APTMS) to improve filler–matrix compatibility. Composite films containing 1, 3, 5, and 7 vol% silane-treated biocarbon were fabricated using the solution casting technique and characterized for mechanical, thermal conductivity, and dielectric properties. FTIR analysis confirmed successful silane functionalization through the formation of Si–O–C and Si–O–Si bonds on the biocarbon surface. Mechanical characterization revealed significant enhancement in tensile strength, tear resistance, and hardness with increasing biocarbon loading up to 5 vol% (MB2). The MB2 composite exhibited nearly 68.7% improvement in tensile strength, 72.2% enhancement in tear strength, and 30.6% increase in hardness compared with neat PVA. Thermal conductivity also improved considerably from 0.21 W/m·K for neat PVA to 0.39 W/m·K for MB2, corresponding to an enhancement of approximately 85.7%. Dielectric analysis demonstrated improved dielectric constant and dielectric loss behaviour due to enhanced interfacial polarization and conductive pathways introduced by the biocarbon reinforcement. The maximum dielectric constant of 3.2 was achieved for MB2, representing approximately 68.4% improvement over neat PVA. However, a slight reduction in properties was observed at 7 vol% loading because of filler agglomeration and microstructural discontinuities. Overall, the developed PVA/biocarbon biocomposite films demonstrated excellent multifunctional characteristics, indicating their strong potential for biodegradable packaging, thermal management systems, flexible electronic substrates, and lightweight dielectric applications.