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<p>This study explores the dynamic mechanical and thermal stability of basalt/Kevlar fiber-reinforced epoxy composites incorporating varying porcelain filler contents (5&#xa0;g to 25&#xa0;g). The composites were analyzed using Dynamic Mechanical Analysis (DMA), thermal properties, thermogravimetric analysis (TGA), and scanning electron microscopy (SEM). Among the fabricated samples, Sample S3, with 15&#xa0;g of porcelain filler, demonstrated the best overall performance across multiple parameters. In the DMA results, Sample S3 achieved the highest storage modulus (~ 6500&#xa0;MPa) around 120&#xa0;°C, compared to S1 (~ 5000&#xa0;MPa), S2 (~ 5200&#xa0;MPa), S4 (~ 6100&#xa0;MPa), and S5 (~ 5900&#xa0;MPa), indicating superior stiffness retention at elevated temperatures. Similarly, S3 exhibited the highest loss modulus (~ 600&#xa0;MPa), reflecting enhanced energy dissipation capacity, compared to other samples. Thermal conductivity measurements revealed that S3 had the lowest thermal conductivity (~ 0.9&#xa0;W/mK), while S1, S2, S4, and S5 showed higher values ranging from 1.1 to 1.4&#xa0;W/mK, highlighting S3’s superior thermal insulation capability. Furthermore, S3 displayed the lowest coefficient of linear thermal expansion (1.7 × 10⁻⁵/°C), compared to higher CTE values (1.8–2.4 × 10⁻⁵/°C) in the other samples, indicating excellent dimensional stability. The HDT of S3 was recorded at 174&#xa0;°C, surpassing S1 (165&#xa0;°C), S2 (169&#xa0;°C), S4 (172&#xa0;°C), and S5 (171&#xa0;°C), confirming better thermal deformation resistance. TGA results showed that S3 retained about 20% residual mass after heating to 400&#xa0;°C, slightly better than the other samples, suggesting enhanced thermal stability. The DTG curve indicated that S3 underwent a slower and more controlled degradation process. SEM analysis further revealed that S3 had a uniform fiber and filler distribution with minimal void formation, whereas other samples exhibited higher levels of agglomeration and microvoids. Based on these results, Sample S3 emerged as the optimal composite for applications requiring a combination of high mechanical strength, thermal insulation, and dimensional stability, making it particularly well-suited for marine, aerospace, automotive, and electronic component applications.</p>

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Investigations on the dynamical and thermal stability of basalt/kevlar fibers reinforced porcelain filler particulates epoxy matrix composite

  • 期刊论文

  • 发表日期：

    2025年6月16日

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  • A. Prem Anandh,
  • P. Sivabalan,
  • Vinayagam Mohanavel,
  • Thandavamoorthy Raja

摘要

This study explores the dynamic mechanical and thermal stability of basalt/Kevlar fiber-reinforced epoxy composites incorporating varying porcelain filler contents (5 g to 25 g). The composites were analyzed using Dynamic Mechanical Analysis (DMA), thermal properties, thermogravimetric analysis (TGA), and scanning electron microscopy (SEM). Among the fabricated samples, Sample S3, with 15 g of porcelain filler, demonstrated the best overall performance across multiple parameters. In the DMA results, Sample S3 achieved the highest storage modulus (~ 6500 MPa) around 120 °C, compared to S1 (~ 5000 MPa), S2 (~ 5200 MPa), S4 (~ 6100 MPa), and S5 (~ 5900 MPa), indicating superior stiffness retention at elevated temperatures. Similarly, S3 exhibited the highest loss modulus (~ 600 MPa), reflecting enhanced energy dissipation capacity, compared to other samples. Thermal conductivity measurements revealed that S3 had the lowest thermal conductivity (~ 0.9 W/mK), while S1, S2, S4, and S5 showed higher values ranging from 1.1 to 1.4 W/mK, highlighting S3’s superior thermal insulation capability. Furthermore, S3 displayed the lowest coefficient of linear thermal expansion (1.7 × 10⁻⁵/°C), compared to higher CTE values (1.8–2.4 × 10⁻⁵/°C) in the other samples, indicating excellent dimensional stability. The HDT of S3 was recorded at 174 °C, surpassing S1 (165 °C), S2 (169 °C), S4 (172 °C), and S5 (171 °C), confirming better thermal deformation resistance. TGA results showed that S3 retained about 20% residual mass after heating to 400 °C, slightly better than the other samples, suggesting enhanced thermal stability. The DTG curve indicated that S3 underwent a slower and more controlled degradation process. SEM analysis further revealed that S3 had a uniform fiber and filler distribution with minimal void formation, whereas other samples exhibited higher levels of agglomeration and microvoids. Based on these results, Sample S3 emerged as the optimal composite for applications requiring a combination of high mechanical strength, thermal insulation, and dimensional stability, making it particularly well-suited for marine, aerospace, automotive, and electronic component applications.