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<p>Interfacial engineering in aluminum/bulk metallic glass (BMG) composite without compromising the amorphous structure has become paramount for hinge material design in next-generation foldable smartphones. Inspired by the principle of severe plastic deformation induced atom rapid diffusion, we designed an Al/Zr-based BMG composite characterized by dual-scale interfacial bonding via additive friction stir deposition (AFSD) with optimized process parameters. Atomic rearrangement and defect-mediated diffusion were activated by shear localization on the BMG surface and severe plastic deformation of Al deposition, leading to the formation of both macroscale mechanical interlocking and a nanoscale polycrystalline layer with an average thickness of 280&#xa0;nm. Different from the established metallurgical bonding dominated by the IMCs layer, the tailored polycrystalline layer comprised of randomly distributed Al<sub>3</sub>Zr, AlZr<sub>3</sub>, and Al nanograins, with an average size of 21.9&#xa0;nm. Importantly, the BMG adjacent to the interface was unaffected and kept disordered atomic structure due to the low thermal cycles. The synergic effect of this dual-scale interfacial microstructure significantly enhanced the shear strength of the as-fabricated composites from 113&#xa0;MPa to 187&#xa0;MPa, increased by 65.5%. This work provides a novel manufacturing and interfacial design strategy, advancing high-performance Al/BMG composites for emerging technological applications.</p>

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Additive friction stir deposition of Al/Zr-based bulk metallic glass composites: dual-scale interfacial formation and strengthening

  • 期刊论文

  • 出版模式：

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  • 发表日期：

    2026年1月10日

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  • Zeyu Zhang,
  • Long Wan,
  • Zhanwen Feng,
  • Youlong Shi,
  • Yong Yang,
  • Qi Wen,
  • Xi Shu

摘要

Interfacial engineering in aluminum/bulk metallic glass (BMG) composite without compromising the amorphous structure has become paramount for hinge material design in next-generation foldable smartphones. Inspired by the principle of severe plastic deformation induced atom rapid diffusion, we designed an Al/Zr-based BMG composite characterized by dual-scale interfacial bonding via additive friction stir deposition (AFSD) with optimized process parameters. Atomic rearrangement and defect-mediated diffusion were activated by shear localization on the BMG surface and severe plastic deformation of Al deposition, leading to the formation of both macroscale mechanical interlocking and a nanoscale polycrystalline layer with an average thickness of 280 nm. Different from the established metallurgical bonding dominated by the IMCs layer, the tailored polycrystalline layer comprised of randomly distributed Al3Zr, AlZr3, and Al nanograins, with an average size of 21.9 nm. Importantly, the BMG adjacent to the interface was unaffected and kept disordered atomic structure due to the low thermal cycles. The synergic effect of this dual-scale interfacial microstructure significantly enhanced the shear strength of the as-fabricated composites from 113 MPa to 187 MPa, increased by 65.5%. This work provides a novel manufacturing and interfacial design strategy, advancing high-performance Al/BMG composites for emerging technological applications.