Optimization and numerical simulation of heat sink for cooling electronic chip

In the recent era, electronic equipment like laptops and mobiles have immense popularity among people due to digitalization in every field and sector. The easy handling in fast and busy life requires, the compact shape and light weight of the electronic components. The reduction in the size of the electronic chips enhanced, the energy density per unit volume on the chip material. The increased energy density fails the chips quickly if the produced heat is not removed. In this research article, a heat sink of five rectangular fins has been optimized to maintain the temperature of the microchip of the size 10 mm × 10 mm × 1 mm in the range of 47 °C–50 °C. Initially, the ANSYS 18.1 has been used for determining the chip temperature, pressure drop, and velocity field in the heat sink by using the numerical investigation at varying inlet air velocity, air inlet temperature, and heat generation in the range of 2–4 m/s, 25 °C–35 °C and 1 × 10⁷–2.5 × 10⁷ W/m³. The data generated by numerical investigation and modeled equations have been optimized using the Response Surface Methodology (RSM). Based on the optimization, the optimum values of the input variables namely air inlet velocity 3.03 m/s, air inlet temperature 25.1010 °C and heat flux 1.12 × 107 W/m3 on which responses Nusselt Number 6.3670, chip temperature 320.0288 K, pressure 2.077 pa, fan power 0.004 W and friction factor 0.1334.