<p>Cooling and thermal management of electronic chipsets, which serve as the core infrastructure of modern technological devices, have received extensive attention. This study investigates the effectiveness of Cu-Al₂O₃/water hybrid nanofluid injection and suction mechanisms in enhancing the thermal management of a heated block modeled as an electronic chipset. To address this objective, a set of numerical simulations were performed on a heated block within a rectangular channel incorporating various injection and suction port configurations, evaluating the impact of eight port positions, seven mass flow rates, and five nanofluid volume fractions. Computational results are validated against available numerical and experimental data. Results demonstrate that altering the injection and suction ports of Cu-Al₂O₃/water hybrid nanofluid leads to heat transfer improvements ranging from 8 to 48%, relative to water flow without injection and suction. Additionally, the I1-S3 configuration shows that increasing the mass flow rates of injection and suction results in a 52.73% enhancement in the <i>Nu/Nu</i>_<i>0</i>, while increasing the hybrid nanofluid volume fraction leads to a 5.39% enhancement. Similarly, the PEC improves by 42.73 and 4.58% due to increased mass flow rates and nanofluid volume fraction, respectively. This numerical analysis highlights the significant impact of combining active flow control with nanofluids on heat transfer augmentation, providing a foundation for optimizing cooling system designs in electronic applications. Furthermore, evaluations across various operating conditions indicate that the I1-S3 configuration offers superior cooling and PEC performance for the heated block compared to the other seven configurations, with the I1-S4 configuration performing second best.</p>