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<p>Cost-effective thermal management coatings are essential for next-generation microelectronics, where rising heat fluxes demand innovative surface engineering. This study demonstrates that graphene-based coatings, engineered via scalable aerosol deposition, can dramatically enhance pool boiling heat transfer by leveraging surface morphology rather than relying solely on bulk thermal conductivity. Three coating variants were developed: two using a gas-phase detonation process with controlled oxygen-to-carbon ratios of 0.3 and 0.75, and one via liquid-phase exfoliation. These coatings were spin-coated onto copper substrates in multiple passes, producing finely textured surfaces with sub-micron graphene flakes and microscale ridges with roughness ranging between 3.2 to 5.8&#xa0;μm. The optimal detonation-synthesized coating of O/C = 0.75 obtained via five passes achieved a heat transfer coefficient (HTC) of 131&#xa0;kW/m<sup>2</sup>°C representing a 152% increase over bare copper and a critical heat flux (CHF) of 174 W/cm<sup>2</sup>, demonstrating 40% enhancement. Multi-scale characterization revealed that these hierarchical features amplified nucleation site density and bubble departure frequency by 68%, while hydrophobicity and increased contact angle hysteresis nearly 32% higher than copper promoted efficient microlayer evaporation. Spectroscopic analysis confirmed tunable defect densities linked to synthesis methods. These results challenge traditional conductivity-centric paradigms, showing that surface morphology and wettability are dominant in enhancing boiling heat transfer. By correlating synthesis parameters and morphological characteristics with boiling performance metrics, this work establishes a framework for designing high-performance, scalable graphene coatings for superior heat dissipation in high-power microelectronic and energy systems. However, further studies are needed to validate the long-term durability and performance of these coatings under real-world operational conditions.</p> Graphical abstract <p></p>

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Oxygenated graphene ink coatings for efficient heat dissipation

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年6月1日

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  • Seyed Alireza Rozati,
  • Kh M. Asif Raihan,
  • Suprem R. Das,
  • Anju Gupta

摘要

Cost-effective thermal management coatings are essential for next-generation microelectronics, where rising heat fluxes demand innovative surface engineering. This study demonstrates that graphene-based coatings, engineered via scalable aerosol deposition, can dramatically enhance pool boiling heat transfer by leveraging surface morphology rather than relying solely on bulk thermal conductivity. Three coating variants were developed: two using a gas-phase detonation process with controlled oxygen-to-carbon ratios of 0.3 and 0.75, and one via liquid-phase exfoliation. These coatings were spin-coated onto copper substrates in multiple passes, producing finely textured surfaces with sub-micron graphene flakes and microscale ridges with roughness ranging between 3.2 to 5.8 μm. The optimal detonation-synthesized coating of O/C = 0.75 obtained via five passes achieved a heat transfer coefficient (HTC) of 131 kW/m2°C representing a 152% increase over bare copper and a critical heat flux (CHF) of 174 W/cm2, demonstrating 40% enhancement. Multi-scale characterization revealed that these hierarchical features amplified nucleation site density and bubble departure frequency by 68%, while hydrophobicity and increased contact angle hysteresis nearly 32% higher than copper promoted efficient microlayer evaporation. Spectroscopic analysis confirmed tunable defect densities linked to synthesis methods. These results challenge traditional conductivity-centric paradigms, showing that surface morphology and wettability are dominant in enhancing boiling heat transfer. By correlating synthesis parameters and morphological characteristics with boiling performance metrics, this work establishes a framework for designing high-performance, scalable graphene coatings for superior heat dissipation in high-power microelectronic and energy systems. However, further studies are needed to validate the long-term durability and performance of these coatings under real-world operational conditions.

Graphical abstract