Study on preparation and microstructure properties of conductive cotton yarn based on chemical additive manufacturing
摘要
A novel liquid droplet infiltration-based chemical additive manufacturing technology was developed to deposit Cu thin films on cotton yarn, innovatively overcoming the full-immersion limitation of traditional chemical deposition. It achieves precise local deposition via dynamic liquid droplet wrapping and programmed movement, improving material utilization and process controllability. With liquid droplet moving speed (30, 60, 90 mm/min) and deposition passes (single-pass/five-passes) as key parameters, the “process-structure-performance” correlation was established. The films are pure FCC nanocrystals (9.6 ~ 16.6 nm); 60 mm/min ensures large grains and structural stability, 90 mm/min with five passes eliminates surface protrusions. Five-pass deposition realizes low resistance (1 ~ 3 Ω/cm) and high conductivity, while single-pass deposition shows better bending resistance stability. Electrochemical tests in 0.9 wt% NaCl solution confirm the film at 30 mm/min has optimal corrosion resistance. This efficient and precise technology provides a new approach for flexible conductive cotton yarn modification, laid the foundation for applications in related fields.