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<p>This study introduces a novel parameter, the Thermal Kinetic Index, for evaluating the interfacial bonding strength in inkjet-printed films fabricated using a direct-write deposition platform with in-situ laser sintering. Systematic variation of laser power, diameter, and scanning rates demonstrates that this ratio serves as a semi-empirical indicator for optimizing laser sintering parameters. Digital image analysis reveals that careful selection of these parameters significantly reduces film porosity and hole size. Micro-scratch tests indicate that variations in these parameters directly influence the critical interfacial binding energy, an effect attributed to distinct pore formations and thermal stresses arising from differing process conditions. Derived from experimental data, the Thermal Kinetic Index provides a comparative framework for enhancing interfacial strength, thereby improving the fabrication process for novel temperature sensors in aero-engines. These findings offer both experimental validation and theoretical insights into the utility of this parameter for advancing direct-write film technology.</p>

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A novel thermal kinetic index method for evaluating interfacial strength in laser-sintered direct-write films

  • 期刊论文

  • 发表日期：

    2026年5月29日

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  • Zhilai Lu,
  • Shenghan Zhang,
  • Jianan Song,
  • Jia Huang,
  • Lu Qiu

摘要

This study introduces a novel parameter, the Thermal Kinetic Index, for evaluating the interfacial bonding strength in inkjet-printed films fabricated using a direct-write deposition platform with in-situ laser sintering. Systematic variation of laser power, diameter, and scanning rates demonstrates that this ratio serves as a semi-empirical indicator for optimizing laser sintering parameters. Digital image analysis reveals that careful selection of these parameters significantly reduces film porosity and hole size. Micro-scratch tests indicate that variations in these parameters directly influence the critical interfacial binding energy, an effect attributed to distinct pore formations and thermal stresses arising from differing process conditions. Derived from experimental data, the Thermal Kinetic Index provides a comparative framework for enhancing interfacial strength, thereby improving the fabrication process for novel temperature sensors in aero-engines. These findings offer both experimental validation and theoretical insights into the utility of this parameter for advancing direct-write film technology.