Scholarlink

<p>This paper investigates the interfacial microstructural characteristics and mechanical properties of aluminum/copper compound castings with regular lattice structures of varying wall thicknesses. The aluminum–copper compound of was studied using hybride squeeze casting, vacuum casting processes combined with stereolithography (SLA) to fabricate the polymeric patterns. Copper lattice structures (preforms) with wall thicknesses of 0.75, 1, and 1.25 mm were fabricated using a hybrid stereolithography (SLA) indirect additive manufacturing process, which involved creating sacrificial polymer patterns, plaster molding, and vacuum casting to produce the Cu preforms. Subsequently, the aluminum/copper compounds were produced via squeeze casting at a pouring temperature of 740&#xa0;°C and a squeeze pressure of 75 MPa. Microstructural studies of the matrix and the aluminum/copper interface, as well as fractography, were conducted using optical microscopes equipped with image analysis, scanning electron microscopy (SEM) equipped with EDS, and three-point bending tests to evaluate the mechanical properties. The application of the squeeze casting process, with an increased solidification rate, prevented the formation of solid-state intermetallic compounds and achieved proper bonding at the interface. The interfacial microstructure of the compounds was found to consist of two layers of θ phase and α+θ eutectic cells. With increasing the preform thickness, the thickness of the interfacial layer decreased linearly. The interfacial microstructure with the preform thicknesses of 0.75, 1, and 1.25 mm exhibited columnar, combination of columnar and equiaxed, and equiaxed θ phase morphologies, respectively. Increasing the preform thickness resulted in the formation of voids between the network structures. The θ phase is the most important microstructural factor in crack growth and propagation during bending. Increasing the preform thickness from 0.75 to 1 mm and then to 1.25 mm increased the bending strength of the compound by 8.9% and then decreased it by 12.6%, respectively.</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Squeeze Casting of Aluminum–Copper Preform with Regular Lattice Structure: Effect of Preform Wall Thickness on the Interfacial Microstructure and Mechanical Properties

  • 期刊论文

  • 发表日期：

    2025年6月19日

查看全文
  • Seyed Abbas Hasasi,
  • Majid Abbasi,
  • Seyed Jamal Hosseinipour

摘要

This paper investigates the interfacial microstructural characteristics and mechanical properties of aluminum/copper compound castings with regular lattice structures of varying wall thicknesses. The aluminum–copper compound of was studied using hybride squeeze casting, vacuum casting processes combined with stereolithography (SLA) to fabricate the polymeric patterns. Copper lattice structures (preforms) with wall thicknesses of 0.75, 1, and 1.25 mm were fabricated using a hybrid stereolithography (SLA) indirect additive manufacturing process, which involved creating sacrificial polymer patterns, plaster molding, and vacuum casting to produce the Cu preforms. Subsequently, the aluminum/copper compounds were produced via squeeze casting at a pouring temperature of 740 °C and a squeeze pressure of 75 MPa. Microstructural studies of the matrix and the aluminum/copper interface, as well as fractography, were conducted using optical microscopes equipped with image analysis, scanning electron microscopy (SEM) equipped with EDS, and three-point bending tests to evaluate the mechanical properties. The application of the squeeze casting process, with an increased solidification rate, prevented the formation of solid-state intermetallic compounds and achieved proper bonding at the interface. The interfacial microstructure of the compounds was found to consist of two layers of θ phase and α+θ eutectic cells. With increasing the preform thickness, the thickness of the interfacial layer decreased linearly. The interfacial microstructure with the preform thicknesses of 0.75, 1, and 1.25 mm exhibited columnar, combination of columnar and equiaxed, and equiaxed θ phase morphologies, respectively. Increasing the preform thickness resulted in the formation of voids between the network structures. The θ phase is the most important microstructural factor in crack growth and propagation during bending. Increasing the preform thickness from 0.75 to 1 mm and then to 1.25 mm increased the bending strength of the compound by 8.9% and then decreased it by 12.6%, respectively.