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<p>In this study, a prediction model for surface solidification time was developed and validated to prevent soldering defects. Defects in the soldering process occur when the surface is exposed in an unsolidified state, significantly impacting process quality and productivity. To prevent defects, it is crucial to proceed with the process after surface solidification. However, if the solidification time is too long, it may lead to decreased productivity and increased risk of other defects. Therefore, accurately predicting the solidification time is essential. In this study, the surface solidification time was analytically interpreted, and the results were validated through soldering case studies. Based on this, a prediction model for surface solidification time was derived, and the defect occurrence frequency under various process conditions was analyzed to determine optimal process conditions. This model is expected to effectively avoid soldering defects and maintain productivity by predicting defect occurrence frequency and providing optimal process conditions for minimizing defects.</p>

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Prediction and Verification of Surface Solidification Time in Die Casting Mold Cavity for Preventing Soldering Defects

  • 期刊论文

  • 发表日期：

    2025年1月30日

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  • Seungcheol Lee,
  • Sinhyeok Do,
  • Dosuck Han,
  • Naksoo Kim

摘要

In this study, a prediction model for surface solidification time was developed and validated to prevent soldering defects. Defects in the soldering process occur when the surface is exposed in an unsolidified state, significantly impacting process quality and productivity. To prevent defects, it is crucial to proceed with the process after surface solidification. However, if the solidification time is too long, it may lead to decreased productivity and increased risk of other defects. Therefore, accurately predicting the solidification time is essential. In this study, the surface solidification time was analytically interpreted, and the results were validated through soldering case studies. Based on this, a prediction model for surface solidification time was derived, and the defect occurrence frequency under various process conditions was analyzed to determine optimal process conditions. This model is expected to effectively avoid soldering defects and maintain productivity by predicting defect occurrence frequency and providing optimal process conditions for minimizing defects.