Interface engineering of Cu/Cu2O nanowires on Cu foam: boosting C–H bond cleavage and suppressing OH− adsorption for efficient formaldehyde electrooxidation
摘要
Formaldehyde oxidation reaction (FOR) demonstrates significant potential in energy conversion and chemical synthesis, yet developing catalysts for efficient operation at high current densities remains a challenge. Herein, we fabricated a Cu/Cu2O heterostructure nanowire catalyst on copper foam (Cu/Cu2O@CF) via interface engineering and investigated its FOR performance. Electrochemical tests show that Cu/Cu2O@CF exhibits excellent activity: it achieves 100 mA cm−2 at an ultra-low potential of −0.05 V (vs. RHE), outperforming most reported catalysts. Notably, this catalyst overcomes the deactivation limitation of conventional Cu-based catalysts above 0.5 V, maintaining a current density of 735 mA cm−2 at 0.6 V with excellent stability during long-term electrolysis. SCN−-induced Cu0 poisoning experiments confirm that Cu/Cu2O@CF retains a Cu/Cu2O mixed structure at 0.6 V, where Cu0−Cu+ synergy dominates its high activity. Density functional theory (DFT) calculations reveal two key advantages of this structure: it weakens OH− adsorption to avoid active site occupation, and reduces C–H bond cleavage barriers while promoting H* combination into H2. Product analysis shows Faradaic efficiencies for formate and H2 production are both ∼100%. When coupled with the hydrogen evolution reaction (HER), the system’s hydrogen production energy consumption is as low as 0.57 kWh m−3 H2, much lower than traditional water electrolysis. This work elucidates the regulatory mechanism of interface engineering on the FOR performance of Cu-based catalysts, expands the application of Cu-based heterostructures in high-current FOR, and guides the development of industrial-grade electrocatalysts.