Scholarlink

<p>The working mechanism of surfactant to reduce acid mist in copper electrowinning system is not well understood. Most of the studies are based on the surface tension reduction phenomenon but this is not the only function that causes acid mist reduction. In this paper, we investigated the effect of different surfactants on a bubble’s residence time, terminal velocity, flow regime, and bursting dynamics using a high-speed camera. We have evaluated five different surfactants and found that the presence of surfactants reduces the terminal velocity, bubble diameter, and increases the residence time of the bubble in electrolyte. Especially for FC-1100, the low terminal velocity and high residence time allowed the bubble to shift its flow regime to stokes flow and allow ample time for stabilization. This was dependent on the small Weber and Ohnesorge number when FC1100 was added, which means the bubbles had less deformation and better stabilization. Therefore, the addition of FC1100 generated bubbles with the lowest kinetic energy during rupture as compared to other surfactants. Most of the kinetic energy is used to elongate the bubble film and a little kinetic energy is used to burst the bubble. To validate our study, we have performed acid mist experiments in a chamber to measure different surfactants’ suppression efficiencies. The results of the study relate terminal velocity, residence time, kinetic energy and bubble diameter to suppression efficiencies that help the understanding of surfactant’s mechanism. Compared to previous studies our work has certain novelties in understanding of bubble growth, propagation and bursting mechanism in a copper electrowinning system in the absence and presence of surfactants with emphasis on surface tension, bubble terminal velocity, residence time and Kinetic energy. While previous research has primarily examined bubble size and its influence on mist generation, as well as the role of surfactants in altering bubble size and suppressing mist, this study expands the focus to include the dynamic behavior of bubbles throughout the life cycle of the bubble.</p> Graphical Abstract <p></p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Optimizing Acid Mist Suppression: Unraveling Surfactant Effects on Bubble Formation and Bursting Dynamics in Copper Electrowinning

  • 期刊论文

  • 出版模式：

    开放获取

  • 发表日期：

    2025年10月13日

查看全文
  • Ashish Kakoria,
  • Mirza Muhammad Zaid,
  • Aamir Iqbal,
  • Ellen Amoako Afful,
  • Guang Xu

摘要

The working mechanism of surfactant to reduce acid mist in copper electrowinning system is not well understood. Most of the studies are based on the surface tension reduction phenomenon but this is not the only function that causes acid mist reduction. In this paper, we investigated the effect of different surfactants on a bubble’s residence time, terminal velocity, flow regime, and bursting dynamics using a high-speed camera. We have evaluated five different surfactants and found that the presence of surfactants reduces the terminal velocity, bubble diameter, and increases the residence time of the bubble in electrolyte. Especially for FC-1100, the low terminal velocity and high residence time allowed the bubble to shift its flow regime to stokes flow and allow ample time for stabilization. This was dependent on the small Weber and Ohnesorge number when FC1100 was added, which means the bubbles had less deformation and better stabilization. Therefore, the addition of FC1100 generated bubbles with the lowest kinetic energy during rupture as compared to other surfactants. Most of the kinetic energy is used to elongate the bubble film and a little kinetic energy is used to burst the bubble. To validate our study, we have performed acid mist experiments in a chamber to measure different surfactants’ suppression efficiencies. The results of the study relate terminal velocity, residence time, kinetic energy and bubble diameter to suppression efficiencies that help the understanding of surfactant’s mechanism. Compared to previous studies our work has certain novelties in understanding of bubble growth, propagation and bursting mechanism in a copper electrowinning system in the absence and presence of surfactants with emphasis on surface tension, bubble terminal velocity, residence time and Kinetic energy. While previous research has primarily examined bubble size and its influence on mist generation, as well as the role of surfactants in altering bubble size and suppressing mist, this study expands the focus to include the dynamic behavior of bubbles throughout the life cycle of the bubble.

Graphical Abstract