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<p>As a substrate material, using acidic, alkaline or oxidizing lapping fluids in sapphire lapping not only poses potential environmental pollution risks but also increases subsequent waste liquid treatment costs. This study achieves green, high-efficiency and low-damage sapphire processing by enhancing interfacial dry tribochemical reactions. Firstly, based on thermodynamic and kinetic calculations, the spontaneous reaction tendency and micro-contact flash temperature range are clarified, providing theoretical support for improving reaction rate. Subsequently, dry friction and wear tests explored the effects of abrasive content on tribological properties and interfacial products. Frictional heat activates the reaction between sapphire and SiO<sub>2</sub>, with the generated soft products removed afterward. Five lapping pads with different high abrasive contents were prepared for tests. Results show the material removal rate first rises then stabilizes with increasing abrasive content: at 85 wt%, it reaches 61.67&#xa0;nm/min, around 71.15% higher than the wet lapping process, and surface roughness decreases to 111.57&#xa0;nm, with no new microscopic scratches or pits in the reaction area. Abrasive content regulates contact point density, and dry environment enhances local frictional flash temperature; these two factors synergistically promote reaction rate and extent. A material removal model for high-abrasive-content induced tribochemical reactions in dry environment is proposed. This study helps develop waste-free tribochemical lapping tools and is significant for green sapphire substrate processing.</p> Graphical Abstract <p></p>

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High SiO2 Abrasive Content Enhances Tribochemical Reactions in Dry Lapping of Sapphire

  • 期刊论文

  • 发表日期：

    2026年7月27日

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  • Zhongyu Bao,
  • Yating Cao,
  • Yifan Ni,
  • Congfu Fang

摘要

As a substrate material, using acidic, alkaline or oxidizing lapping fluids in sapphire lapping not only poses potential environmental pollution risks but also increases subsequent waste liquid treatment costs. This study achieves green, high-efficiency and low-damage sapphire processing by enhancing interfacial dry tribochemical reactions. Firstly, based on thermodynamic and kinetic calculations, the spontaneous reaction tendency and micro-contact flash temperature range are clarified, providing theoretical support for improving reaction rate. Subsequently, dry friction and wear tests explored the effects of abrasive content on tribological properties and interfacial products. Frictional heat activates the reaction between sapphire and SiO2, with the generated soft products removed afterward. Five lapping pads with different high abrasive contents were prepared for tests. Results show the material removal rate first rises then stabilizes with increasing abrasive content: at 85 wt%, it reaches 61.67 nm/min, around 71.15% higher than the wet lapping process, and surface roughness decreases to 111.57 nm, with no new microscopic scratches or pits in the reaction area. Abrasive content regulates contact point density, and dry environment enhances local frictional flash temperature; these two factors synergistically promote reaction rate and extent. A material removal model for high-abrasive-content induced tribochemical reactions in dry environment is proposed. This study helps develop waste-free tribochemical lapping tools and is significant for green sapphire substrate processing.

Graphical Abstract