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<p>Force rheological polishing (FRP) is an efficient and low-damage flow-field polishing method. The regulation of the flow field through constrained flow passage (CFP) to achieve controlled material removal is of significant importance for advancing FRP. The constrained-flow-field force-rheological-polishing (CFF-FRP) method is an ultra-precision polishing technique that utilizes the shear-thickening characteristics of a non-Newtonian polishing fluid to achieve material removal within a CFP. The flow characteristics of the constrained flow field were theoretical investigated and experimentally validated, confirming that the flow state during CFF-FRP is fully developed laminar flow. The flow field simulations were conducted based on the known flow state and the polishing fluid’s rheological curve. Based on the Preston equation, the product of pressure and velocity near the wall of the flow field is employed to evaluate the material removal rate, yielding simulation results of material removal distribution along the flow direction from three CFP structures with a wall inclination angle α of 0°, 2°, and 4°. Experimental studies on CFF-FRP were carried out, with material removal distribution characterized by changes in surface profile along the flow direction. When α is 0°, the material removal is pronounced at both ends but low in the central region. Whereas at α values of 2° and 4°, the flow field distribution shifts, resulting in a trend of lower removal at the ends and higher removal in the central region. The experimental and simulation results showed generally consistent trends in material removal distribution, proving the feasibility of controlling material removal distribution by varying the CFP configuration. Additionally, due to the abrasive particles’ straight-line machining trajectory, comet-tail defects appeared on the workpiece surface, eventually evolving into elongated scratches. Finally, by introducing rotational motion to the workpiece, complex polishing trajectories achieved high-quality flat polishing. Surface roughness <i>S</i><sub>a</sub> decreased from an initial value of 170&#xa0;nm to a final value of 38&#xa0;nm.</p>

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Flow Field Behavior and Material Removal Characteristics of Constrained-Flow-Field Force-Rheological-Polishing

  • 期刊论文

  • 发表日期：

    2026年3月5日

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  • Shuqi Wang,
  • Tenglu He,
  • Jinhu Wang,
  • Julong Yuan,
  • Binghai Lyu

摘要

Force rheological polishing (FRP) is an efficient and low-damage flow-field polishing method. The regulation of the flow field through constrained flow passage (CFP) to achieve controlled material removal is of significant importance for advancing FRP. The constrained-flow-field force-rheological-polishing (CFF-FRP) method is an ultra-precision polishing technique that utilizes the shear-thickening characteristics of a non-Newtonian polishing fluid to achieve material removal within a CFP. The flow characteristics of the constrained flow field were theoretical investigated and experimentally validated, confirming that the flow state during CFF-FRP is fully developed laminar flow. The flow field simulations were conducted based on the known flow state and the polishing fluid’s rheological curve. Based on the Preston equation, the product of pressure and velocity near the wall of the flow field is employed to evaluate the material removal rate, yielding simulation results of material removal distribution along the flow direction from three CFP structures with a wall inclination angle α of 0°, 2°, and 4°. Experimental studies on CFF-FRP were carried out, with material removal distribution characterized by changes in surface profile along the flow direction. When α is 0°, the material removal is pronounced at both ends but low in the central region. Whereas at α values of 2° and 4°, the flow field distribution shifts, resulting in a trend of lower removal at the ends and higher removal in the central region. The experimental and simulation results showed generally consistent trends in material removal distribution, proving the feasibility of controlling material removal distribution by varying the CFP configuration. Additionally, due to the abrasive particles’ straight-line machining trajectory, comet-tail defects appeared on the workpiece surface, eventually evolving into elongated scratches. Finally, by introducing rotational motion to the workpiece, complex polishing trajectories achieved high-quality flat polishing. Surface roughness Sa decreased from an initial value of 170 nm to a final value of 38 nm.