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<p>To address issues in traditional double-sided lapping machines, such as machining accuracy drift, structural thermal deformation, and insufficient intelligence, this study designed a high-precision double-sided lapping machine structure system oriented toward intelligent control systems, providing a physical carrier platform for subsequent system implementation. Based on the structural stability and dynamic adjustment requirements during machining, the machine adopted a swing-type structure and modular assembly architecture to construct a mechanical system with dynamic compensation characteristics. Finite-element-method-based static simulation and modal analysis ensured the rational design of critical components and structures while maintaining favorable dynamic stability. To resolve the lapping plate thermal deformation challenges, a low coefficient of thermal expansion (CTE) Invar alloy 4J36 was selected as the base material with embedded cooling channels designed to enhance temperature control. Fluid&#xa0;structure&#xa0;thermal interaction (FSTI) analysis shows that, under identical operating conditions, the thermal deformation of this material is reduced by nearly an order of magnitude compared with conventional alternative substrates. The machine integrates dual-airbag lever-pressurized mechanisms, high-rigidity lower-plate support structure, and dressing units. Simultaneously, a multi-source sensor network was embedded to provide the hardware foundations for data acquisition in intelligent control systems. Preliminary glass substrate machining experiments were conducted to verify the fundamental mechanical and structural performance. The results indicate that the total thickness variation (TTV) of the post-processed substrate is below 3&#xa0;μm, validating the rationality and feasibility of the proposed design as a deployment and verification platform for subsequent intelligent control frameworks.</p>

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Design and development of a high-precision intelligent double-sided lapping machine

  • 期刊论文

  • 发表日期：

    2026年6月30日

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  • You-Kang Sun,
  • Shu-Jie Liu,
  • Xue-Jun Qian,
  • Geng-Xin Liu,
  • Yong-Kang Chen,
  • Xiang-Ping Tang,
  • Yong-Fu Chen,
  • Jiang Guo

摘要

To address issues in traditional double-sided lapping machines, such as machining accuracy drift, structural thermal deformation, and insufficient intelligence, this study designed a high-precision double-sided lapping machine structure system oriented toward intelligent control systems, providing a physical carrier platform for subsequent system implementation. Based on the structural stability and dynamic adjustment requirements during machining, the machine adopted a swing-type structure and modular assembly architecture to construct a mechanical system with dynamic compensation characteristics. Finite-element-method-based static simulation and modal analysis ensured the rational design of critical components and structures while maintaining favorable dynamic stability. To resolve the lapping plate thermal deformation challenges, a low coefficient of thermal expansion (CTE) Invar alloy 4J36 was selected as the base material with embedded cooling channels designed to enhance temperature control. Fluid structure thermal interaction (FSTI) analysis shows that, under identical operating conditions, the thermal deformation of this material is reduced by nearly an order of magnitude compared with conventional alternative substrates. The machine integrates dual-airbag lever-pressurized mechanisms, high-rigidity lower-plate support structure, and dressing units. Simultaneously, a multi-source sensor network was embedded to provide the hardware foundations for data acquisition in intelligent control systems. Preliminary glass substrate machining experiments were conducted to verify the fundamental mechanical and structural performance. The results indicate that the total thickness variation (TTV) of the post-processed substrate is below 3 μm, validating the rationality and feasibility of the proposed design as a deployment and verification platform for subsequent intelligent control frameworks.