<p>This study investigates the mechanical properties and thermal conductivity of metal parts produced using metal fused filament fabrication (Metal FFF), focusing on three distinct printing profiles (Fast, Strong, and Quality) provided by the material manufacturer. The correlation between thermal conductivity and mechanical strength is explored, aiming to optimize part performance by understanding the impact of printing parameters. Results demonstrate that the “Quality” profile delivers superior mechanical strength and thermal conductivity due to enhanced inter-layer bonding and reduced porosity, as confirmed by SEM analysis. Conversely, the “Fast” profile offers the lowest performance but maximizes productivity and cost-efficiency. The “Strong” profile represents a balanced compromise among mechanical performance, thermal properties, and manufacturing cost. This work highlights the potential of using thermal conductivity tests as a faster and more resource-efficient proxy for mechanical testing in initial assessments. Such tests are particularly valuable in applications where thermal conductivity is a critical requirement (e.g., battery thermal management systems, heat exchangers, cooling systems in electronic, etc.). Future research should focus on developing predictive models to further streamline the characterization and optimization of Metal FFF processes for industrial applications.</p>

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Correlation between ultimate tensile strength and thermal conductivity of 316L metal parts obtained through fused filament fabrication

  • C. Tosto,
  • L. Saitta,
  • R. Barbagallo,
  • G. Mirone,
  • I. Blanco,
  • G. Cicala

摘要

This study investigates the mechanical properties and thermal conductivity of metal parts produced using metal fused filament fabrication (Metal FFF), focusing on three distinct printing profiles (Fast, Strong, and Quality) provided by the material manufacturer. The correlation between thermal conductivity and mechanical strength is explored, aiming to optimize part performance by understanding the impact of printing parameters. Results demonstrate that the “Quality” profile delivers superior mechanical strength and thermal conductivity due to enhanced inter-layer bonding and reduced porosity, as confirmed by SEM analysis. Conversely, the “Fast” profile offers the lowest performance but maximizes productivity and cost-efficiency. The “Strong” profile represents a balanced compromise among mechanical performance, thermal properties, and manufacturing cost. This work highlights the potential of using thermal conductivity tests as a faster and more resource-efficient proxy for mechanical testing in initial assessments. Such tests are particularly valuable in applications where thermal conductivity is a critical requirement (e.g., battery thermal management systems, heat exchangers, cooling systems in electronic, etc.). Future research should focus on developing predictive models to further streamline the characterization and optimization of Metal FFF processes for industrial applications.