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<p>This article primarily investigates the grinding mechanism of Inconel 718 under ultrasonic vibration-assisted grinding (UVAG), with a focus on optimizing the cutting-edge design and geometric configuration of diamond abrasives. Establishing three types of abrasive tips linear array by finite element models and comparing the changes in stress, grinding force, and chip formation during grinding reveal point-tip abrasives exhibiting the smallest grinding force, 60% of that of the linear-tip and the faceted-tip abrasives, along with the smallest chip volume and enhancing chip removal efficiency. Subsequently, developing mathematical and geometric modeling for point-tip abrasives with 4 different cutting-edge quantities and comparing the workpiece surface morphology, grinding force magnitude and exit burrs confirm the superior performance of tetrahedral-shaped abrasives, yielding the highest post-grinding surface accuracy. Further, grinding efficiency and force magnitude of matrix abrasives arrays, respectively, comprising tetrahedral-shaped and pyramid-shaped are analyzed under varying entry angles. The findings demonstrate that reducing the number of cutting edges exposed in the grinding direction decreases friction between chips and abrasives, thereby significantly enhancing grinding efficiency. Finally, the simulation model is validated with errors of 7.71%, 5.12%, and 4.86% at grinding speeds of 20&#xa0;m/s, 40&#xa0;m/s and 60&#xa0;m/s, respectively, and integrating ultrasonic vibrations into the grinding system reduces forces to 56% of conventional levels, highlighting the importance of abrasive geometry in 3D-UVAG of Inconel 718. The findings are expected to contribute to the development of more efficient and precise 3D-UVAG grinding processes for aerospace applications.</p>

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Geometric characteristics mechanism of diamond abrasives for 3D ultrasonic vibration-assisted grinding on Inconel 718

  • 期刊论文

  • 发表日期：

    2025年9月2日

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  • Rao Yao,
  • Dazhong Wang,
  • Yang Yang,
  • Qingying Li

摘要

This article primarily investigates the grinding mechanism of Inconel 718 under ultrasonic vibration-assisted grinding (UVAG), with a focus on optimizing the cutting-edge design and geometric configuration of diamond abrasives. Establishing three types of abrasive tips linear array by finite element models and comparing the changes in stress, grinding force, and chip formation during grinding reveal point-tip abrasives exhibiting the smallest grinding force, 60% of that of the linear-tip and the faceted-tip abrasives, along with the smallest chip volume and enhancing chip removal efficiency. Subsequently, developing mathematical and geometric modeling for point-tip abrasives with 4 different cutting-edge quantities and comparing the workpiece surface morphology, grinding force magnitude and exit burrs confirm the superior performance of tetrahedral-shaped abrasives, yielding the highest post-grinding surface accuracy. Further, grinding efficiency and force magnitude of matrix abrasives arrays, respectively, comprising tetrahedral-shaped and pyramid-shaped are analyzed under varying entry angles. The findings demonstrate that reducing the number of cutting edges exposed in the grinding direction decreases friction between chips and abrasives, thereby significantly enhancing grinding efficiency. Finally, the simulation model is validated with errors of 7.71%, 5.12%, and 4.86% at grinding speeds of 20 m/s, 40 m/s and 60 m/s, respectively, and integrating ultrasonic vibrations into the grinding system reduces forces to 56% of conventional levels, highlighting the importance of abrasive geometry in 3D-UVAG of Inconel 718. The findings are expected to contribute to the development of more efficient and precise 3D-UVAG grinding processes for aerospace applications.