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<p>Modern lighting technology praises high-power light-emitting diodes (HPLEDs) for their superior efficiency compared to traditional light sources. This study investigates the intricate relationship between the service life of HPLEDs, the junction temperature (<i>T</i><sub>j</sub>), and heat dissipation using drop-shaped pin fin heat sinks attached to the HPLED. Four different power inputs, 50, 100, 150, and 200&#xa0;W, were analyzed using three different vertical pin fin spacings (<i>S</i><sub>v</sub> = 25, 50, and 75&#xa0;mm). A data acquisition system was used to measure temperature, current, LED light intensity (Lux), and voltage values using sensors. These values were then used as the best possible reference values for a well-known Arrhenius equation model to predict the lifetime of the device. The results show that as power input levels rise, <i>T</i><sub>j</sub> also increases, which reduces the life of HPLEDs. Results show an inverse relationship between device lifetime and T<sub>j</sub>, exhibiting exponential decay. For 200 and 50 W power inputs, respectively, the maximum junction temperature of the HPLED-attaching drop-shaped pin fin heat sink was found to be 134.78&#xa0;°C, and the minimum <i>T</i><sub>j</sub> was found to be 60.13&#xa0;°C. The drop-shaped pin fin heat sink with a 75-mm fin spacing was found to have a maximum heat transfer coefficient of 9.81&#xa0;W/m<sup>2</sup>&#xa0;K. With a 200&#xa0;W power dissipation and a junction temperature (<i>T</i><sub>j</sub>) of 134.78&#xa0;°C, the HPLED had a short expected operational life of 1780.2&#xa0;h. On the other hand, a projected lifetime of 3996.30&#xa0;h is anticipated at a higher temperature of <i>T</i><sub>j</sub> = 112.18&#xa0;°C.</p>

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Heat transfer and lifetime estimation of high-power light-emitting diodes (HPLEDs) using drop-shaped pin fin heat sink under natural convection

  • 期刊论文

  • 发表日期：

    2025年3月22日

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  • Ram Deshmukh,
  • V. N. Raibhole

摘要

Modern lighting technology praises high-power light-emitting diodes (HPLEDs) for their superior efficiency compared to traditional light sources. This study investigates the intricate relationship between the service life of HPLEDs, the junction temperature (Tj), and heat dissipation using drop-shaped pin fin heat sinks attached to the HPLED. Four different power inputs, 50, 100, 150, and 200 W, were analyzed using three different vertical pin fin spacings (Sv = 25, 50, and 75 mm). A data acquisition system was used to measure temperature, current, LED light intensity (Lux), and voltage values using sensors. These values were then used as the best possible reference values for a well-known Arrhenius equation model to predict the lifetime of the device. The results show that as power input levels rise, Tj also increases, which reduces the life of HPLEDs. Results show an inverse relationship between device lifetime and Tj, exhibiting exponential decay. For 200 and 50 W power inputs, respectively, the maximum junction temperature of the HPLED-attaching drop-shaped pin fin heat sink was found to be 134.78 °C, and the minimum Tj was found to be 60.13 °C. The drop-shaped pin fin heat sink with a 75-mm fin spacing was found to have a maximum heat transfer coefficient of 9.81 W/m2 K. With a 200 W power dissipation and a junction temperature (Tj) of 134.78 °C, the HPLED had a short expected operational life of 1780.2 h. On the other hand, a projected lifetime of 3996.30 h is anticipated at a higher temperature of Tj = 112.18 °C.