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<p>Nanocrystalline alloys often exhibit unusual thermal stability as a consequence of kinetic and thermodynamic barriers to grain growth. However, the physical mechanisms governing alloy stability need to be identified. In this work, we found that grain boundary (GB) relaxation renders Ni–W alloyed films relatively stable at low annealing temperature, while twinning-mediated grain growth occurs via dislocation-GB/twin boundary (TB) interactions as the annealing temperature increases. At a relatively low temperature, TB strengthening plays a dominant role in plastic deformation, whereas precipitation strengthening gradually controls the deformation mechanism with the increase of annealing temperature. Our findings provide evidence for improving mechanical property through alloying and microstructure design, and have a crucial guiding significance in material selection and miniaturized applications such as Micro Electro Mechanical Systems.</p>

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Thermal Stability and Mechanical Properties of Nanotwinned Ni–W Alloyed Films

  • 期刊论文

  • 发表日期：

    2025年5月26日

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  • Shuyi Ren,
  • Jiao Li,
  • Kai Wu,
  • Xiaoge Li,
  • Yaqiang Wang,
  • Jinyu Zhang,
  • Gang Liu,
  • Jun Sun

摘要

Nanocrystalline alloys often exhibit unusual thermal stability as a consequence of kinetic and thermodynamic barriers to grain growth. However, the physical mechanisms governing alloy stability need to be identified. In this work, we found that grain boundary (GB) relaxation renders Ni–W alloyed films relatively stable at low annealing temperature, while twinning-mediated grain growth occurs via dislocation-GB/twin boundary (TB) interactions as the annealing temperature increases. At a relatively low temperature, TB strengthening plays a dominant role in plastic deformation, whereas precipitation strengthening gradually controls the deformation mechanism with the increase of annealing temperature. Our findings provide evidence for improving mechanical property through alloying and microstructure design, and have a crucial guiding significance in material selection and miniaturized applications such as Micro Electro Mechanical Systems.