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<p>Conventional high-temperature joining processes introduce large residual thermal stresses between graphite and metals, which has become a key bottleneck for thermal management in advanced electronics. Thus, there is a strong demand for low-temperature joining of graphite and metals. This study develops a new ultrasonic-assisted soldering method that achieves robust bonding between porous graphite and 6063Al alloy at only 200&#xa0;°C using commercial Sn-9Zn solder without active elements. Through precisely controlled ultrasonic vibrations (20&#xa0;kHz, 1&#xa0;kW) applied for 90&#xa0;s, joints with an&#xa0;exceptional shear strength of 17.49&#xa0;MPa were realized. Microstructure analysis indicated that the ultrasonic cavitation effect triggered the directional dissolution of Al from the base metal, converting the originally inactive Sn-Zn solder into an active Sn-Zn-Al solder. The deposition reaction of the active Al element with the O element dissolved into the solder spontaneously formed a continuous nanoscale amorphous Al₂O₃ transition layer at the graphite/solder interface. This nanoscale structure fundamentally transforms the bonding mechanism, creating covalent C-O–Al linkages with graphite.&#xa0;The technique eliminates complex metallization procedures and expensive active fillers, offering an industrially scalable solution for next-generation electronic packaging.</p>

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The influence of ultrasonic time on the microstructure and properties of 6063Al-graphite joint during ultrasonic-assisted soldering using non-active solder

  • 期刊论文

  • 发表日期：

    2026年6月17日

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  • Kunjie Luo,
  • Xinyue Shi,
  • Pu Zhao,
  • Mengmeng Zhu,
  • Yuanhang Xia,
  • Jiuchun Yan

摘要

Conventional high-temperature joining processes introduce large residual thermal stresses between graphite and metals, which has become a key bottleneck for thermal management in advanced electronics. Thus, there is a strong demand for low-temperature joining of graphite and metals. This study develops a new ultrasonic-assisted soldering method that achieves robust bonding between porous graphite and 6063Al alloy at only 200 °C using commercial Sn-9Zn solder without active elements. Through precisely controlled ultrasonic vibrations (20 kHz, 1 kW) applied for 90 s, joints with an exceptional shear strength of 17.49 MPa were realized. Microstructure analysis indicated that the ultrasonic cavitation effect triggered the directional dissolution of Al from the base metal, converting the originally inactive Sn-Zn solder into an active Sn-Zn-Al solder. The deposition reaction of the active Al element with the O element dissolved into the solder spontaneously formed a continuous nanoscale amorphous Al₂O₃ transition layer at the graphite/solder interface. This nanoscale structure fundamentally transforms the bonding mechanism, creating covalent C-O–Al linkages with graphite. The technique eliminates complex metallization procedures and expensive active fillers, offering an industrially scalable solution for next-generation electronic packaging.