<p>Over the last decades, the development of micro- and nanoparticle pastes (nanopastes) for sinter-bonding (sintering) has been a major research effort in the field of micro- and nanojoining, firstly of Ag-based pastes, and more recently also of Cu-based pastes. One classical application scenario is semiconductor die attach for power electronics, where sintering can provide bonds with superior temperature stability as well as thermal and electrical conductivity. A recently proposed novel application field is the use of sinter-bonding for transfer and integration of functional thin films: thin films and 2D materials can offer unique properties, e.g. for sensing, catalysis, and electronics. However, film manufacturing often requires distinct growth conditions. For subsequent film integration into a functional device, the films must be transferred and bonded to a suitable host structure. Current transfer methods often lead to film damage and/or insufficient bond qualities. In this work, we present sinter-bonding with nanopastes as a flexible and easy-to-use method to realise high-quality thin-film transfers and provide an in-depth discussion of the process steps and bonding mechanisms.</p>