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<p>Sn-Ag-Cu (SAC) solders have become the most widely used lead-free alternatives. However, during soldering, Ag<sub>3</sub>Sn and Cu<sub>6</sub>Sn<sub>5</sub> intermetallic compounds are formed, which can adversely affect the overall solder joint quality. Therefore, the Sn-3.0Ag-0.5Cu (SAC305) lead-free solder was selected as the substrate. In this study, 2 wt.% Sb, 3 wt.% Bi, and <i>x</i> wt.% Ni (<i>x</i> = 0.05, 0.1, 0.2) were simultaneously added to the SAC305 solder to prepare the SAC305-2Sb-3Bi-<i>x</i>Ni alloys. The physical properties, microstructure, Vickers hardness, wetting behavior, tensile strength, and other characteristics were subsequently analyzed. The results show that when 0.10 wt.% Ni is added, the alloy exhibits the most refined microstructure, the highest hardness, and the best wettability. The interfacial IMC growth coefficient (<i>k</i>) decreases from 0.0304 in SAC305 to 0.0171 with the addition of 0.10 wt.% Ni, indicating a pronounced inhibitory effect of Ni on IMC growth. Moreover, the tensile strength of the solder joint increases to 63.1527&#xa0;MPa, representing an enhancement of 21.3277&#xa0;MPa compared with SAC305. Overall, 0.10 wt.% Ni addition provides the optimal combination of microstructural refinement, interfacial stability, and mechanical performance.</p>

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Effect of Ni content on interfacial structure and tensile strength of SACSBN/Cu solder joints

  • 期刊论文

  • 发表日期：

    2026年1月22日

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  • Yipeng Xiang,
  • Biao Wang,
  • Jiayi Xu,
  • Jikang Yan

摘要

Sn-Ag-Cu (SAC) solders have become the most widely used lead-free alternatives. However, during soldering, Ag3Sn and Cu6Sn5 intermetallic compounds are formed, which can adversely affect the overall solder joint quality. Therefore, the Sn-3.0Ag-0.5Cu (SAC305) lead-free solder was selected as the substrate. In this study, 2 wt.% Sb, 3 wt.% Bi, and x wt.% Ni (x = 0.05, 0.1, 0.2) were simultaneously added to the SAC305 solder to prepare the SAC305-2Sb-3Bi-xNi alloys. The physical properties, microstructure, Vickers hardness, wetting behavior, tensile strength, and other characteristics were subsequently analyzed. The results show that when 0.10 wt.% Ni is added, the alloy exhibits the most refined microstructure, the highest hardness, and the best wettability. The interfacial IMC growth coefficient (k) decreases from 0.0304 in SAC305 to 0.0171 with the addition of 0.10 wt.% Ni, indicating a pronounced inhibitory effect of Ni on IMC growth. Moreover, the tensile strength of the solder joint increases to 63.1527 MPa, representing an enhancement of 21.3277 MPa compared with SAC305. Overall, 0.10 wt.% Ni addition provides the optimal combination of microstructural refinement, interfacial stability, and mechanical performance.