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<p>This study employed finite element analysis (FEA) simulations to model the laser soldering process for vacuum glazing, focusing on key indicators: the maximum temperature of glass (MTG), the duration of solder maintaining the soldering temperature (DSMST), and the maximum stress of glass (MSG). Response surface methodology (RSM) was applied to optimize soldering parameters, including laser power, soldering speed, and defocus distance. The simulation results revealed that the primary factors influencing MTG, DSMST, and MSG are the defocus distance, soldering speed, defocus distance and laser power, respectively. Multiple regression fitting identified the optimal soldering parameters as a laser power of 51.2 W, a soldering speed of 1&#xa0;mm·s⁻<sup>1</sup>, and a defocus distance of 400&#xa0;mm. Under these parameters, the simulation values for MTG, DSMST, and MSG deviated from the predicted values by less than ± 5.0%. Microstructural observations were performed on vacuum glazing samples prepared under varying parameter conditions. The results showed that the optimal soldering parameters for vacuum glazing were a laser power of in the range 45–60 W, a soldering speed below 1.0&#xa0;mm·s⁻<sup>1</sup>, and a defocus distance in the range of 350–400&#xa0;mm. Excessively high or low parameters could cause damage to the glass substrate or poor density of solder forming. During the laser soldering process, solder elements diffused into the glass, with the extent of this diffusion being influenced by the soldering parameters.</p>

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Laser parameters optimization for vacuum glazing: simulation, experiment and microstructural analysis

  • 期刊论文

  • 发表日期：

    2025年10月18日

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  • Yunhan Zou,
  • Jieyuan Ding,
  • Lianjie Han,
  • Yu Wang,
  • Yangjie Shi,
  • Xiaobo Xi

摘要

This study employed finite element analysis (FEA) simulations to model the laser soldering process for vacuum glazing, focusing on key indicators: the maximum temperature of glass (MTG), the duration of solder maintaining the soldering temperature (DSMST), and the maximum stress of glass (MSG). Response surface methodology (RSM) was applied to optimize soldering parameters, including laser power, soldering speed, and defocus distance. The simulation results revealed that the primary factors influencing MTG, DSMST, and MSG are the defocus distance, soldering speed, defocus distance and laser power, respectively. Multiple regression fitting identified the optimal soldering parameters as a laser power of 51.2 W, a soldering speed of 1 mm·s⁻1, and a defocus distance of 400 mm. Under these parameters, the simulation values for MTG, DSMST, and MSG deviated from the predicted values by less than ± 5.0%. Microstructural observations were performed on vacuum glazing samples prepared under varying parameter conditions. The results showed that the optimal soldering parameters for vacuum glazing were a laser power of in the range 45–60 W, a soldering speed below 1.0 mm·s⁻1, and a defocus distance in the range of 350–400 mm. Excessively high or low parameters could cause damage to the glass substrate or poor density of solder forming. During the laser soldering process, solder elements diffused into the glass, with the extent of this diffusion being influenced by the soldering parameters.