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<p>The effectiveness of electromagnetic pulse welding is predominantly governed by the collision angle and impact velocity. This study investigates the micro-scale interfacial bonding mechanism of Copper/Copper electromagnetic-pulse welding via molecular dynamics simulations. The simulations reveal that the wavy interface formation results from plastic deformation caused by interfacial instability upon collision, accompanied by the emission of a metallic jet. Simulations with controlled collision angles show that a small angle does not generate a wavy interface. Furthermore, as the angle increases, jet atoms undergo repeated collisions between the plates, leading to the formation of a wavy interface. However, beyond a critical angle, the frequency of these reciprocal collisions decreases, consequently reducing the wavy interface frequency. Furthermore, analysis of the average interface temperature establishes the correlation between metal jets and wavy interface formation. Collision velocity simulations indicate that increased velocity promotes interfacial wave generation. Regional pressure analysis reveals that the effective interfacial length at a discharge energy of 39 kJ is less than that observed at 35 kJ.</p>

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The molecular dynamics simulation of collision processes at copper/copper electromagnetic pulse welding interface

  • 期刊论文

  • 发表日期：

    2025年11月8日

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  • Long Zhang,
  • Xuemei Duan,
  • Limeng Yin

摘要

The effectiveness of electromagnetic pulse welding is predominantly governed by the collision angle and impact velocity. This study investigates the micro-scale interfacial bonding mechanism of Copper/Copper electromagnetic-pulse welding via molecular dynamics simulations. The simulations reveal that the wavy interface formation results from plastic deformation caused by interfacial instability upon collision, accompanied by the emission of a metallic jet. Simulations with controlled collision angles show that a small angle does not generate a wavy interface. Furthermore, as the angle increases, jet atoms undergo repeated collisions between the plates, leading to the formation of a wavy interface. However, beyond a critical angle, the frequency of these reciprocal collisions decreases, consequently reducing the wavy interface frequency. Furthermore, analysis of the average interface temperature establishes the correlation between metal jets and wavy interface formation. Collision velocity simulations indicate that increased velocity promotes interfacial wave generation. Regional pressure analysis reveals that the effective interfacial length at a discharge energy of 39 kJ is less than that observed at 35 kJ.