Internal reactive wetting of AMg6 plate with zinc solder
摘要
This paper presents the results of a comprehensive study on the internal wetting process of an aluminum plate during fluxless soldering with zinc solder. The research specifically focuses on solder wicking beneath the oxide layer. Laboratory experiments were conducted using two aluminum alloy plates and zinc solder. The study included microstructure analysis of thin cross-sections of the plates, as well as X-ray fluorescence analysis of surface samples. A mathematical model was developed to describe the internal reactive wetting of the plate, considering its dissolution. Finally, the numerical calculations were compared with experimental data from the laboratory analysis.