High-strength heterostructure joint of 6063Al alloys manufactured by ultrasonic-assisted TLP bonding using an Zn/Mg/Zn composite interlayer
摘要
As the most advanced development of low-temperature and high-strength diffusion bonding of Al alloys, the lowest joining temperature of ultrasonic-assisted transient liquid phase (U-TLP) bonding of Al alloys can only be limited to 390 °C using Zn interlayer. Further reduction of bonding temperature is an urgent need to avoid strength loss of base metal. In this work, U-TLP bonding of 6063Al alloy only required 350 °C, which was achieved in the air by a newly designed composite interlayer of Zn/Mg/Zn. The surface oxide films on metals were broken by the cavitation effect of ultrasonic in Mg-Zn eutectic liquid phase. The joint composition undergone a transition from MgZn2 + η-Zn to MgZn2 + η-Zn + Zn-Al eutectoid to MgZn2 + Zn-Al eutectoid. Final joint of MgZn2 + Zn-Al eutectoid with a strength coefficient of 100% was obtained only required an ultrasonic vibration of 180 s. The initial joint was a brittle structure composed by the MgZn2 and the η-Zn phases, and it finally transformed to a reinforced structure with a network shape of the Zn-Al eutectoid-coated dispersed MgZn2 particles. The joint was strengthened due to the Zn-Al eutectoid phase and MgZn2 hard particles with differences in hardness based on the heterogeneous deformation strengthening theory.