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Outcomes and Conclusions from the 2022 AM Bench Measurements, Challenge Problems, Modeling Submissions, and Conference

  • Lyle Levine,
  • Brandon Lane,
  • Chandler Becker,
  • James Belak,
  • Robert Carson,
  • David Deisenroth,
  • Edward Glaessgen,
  • Thomas Gnaupel-Herold,
  • Michael Gorelik,
  • Gretchen Greene,
  • Saadi Habib,
  • Callie Higgins,
  • Michael Hill,
  • Nik Hrabe,
  • Jason Killgore,
  • Jai Won Kim,
  • Gerard Lemson,
  • Kalman Migler,
  • Shawn Moylan,
  • Darren Pagan,
  • Thien Phan,
  • Maxwell Praniewicz,
  • David Rowenhorst,
  • Edwin Schwalbach,
  • Jonathan Seppala,
  • Brian Simonds,
  • Mark Stoudt,
  • Jordan Weaver,
  • Ho Yeung,
  • Fan Zhang

摘要

The Additive Manufacturing Benchmark Test Series (AM Bench) provides rigorous measurement data for validating additive manufacturing (AM) simulations for a broad range of AM technologies and material systems. AM Bench includes extensive in situ and ex situ measurements, simulation challenges for the AM modeling community, and a corresponding conference series. In 2022, the second round of AM Bench measurements, challenge problems, and conference were completed, focusing primarily upon laser powder bed fusion (LPBF) processing of metals, and both material extrusion processing and vat photopolymerization of polymers. In all, more than 100 people from 10 National Institute of Standards and Technology (NIST) divisions and 21 additional organizations were directly involved in the AM Bench 2022 measurements, data management, and conference organization. The international AM community submitted 138 sets of blind modeling simulations for comparison with the in situ and ex situ measurements, up from 46 submissions for the first round of AM Bench in 2018. Analysis of these submissions provides valuable insight into current AM modeling capabilities. The AM Bench data are permanently archived and freely accessible online. The AM Bench conference also hosted an embedded workshop on qualification and certification of AM materials and components.