On Heat Transfer Enhancement from Horizontal Rectangular Stepped Fin Array Under Free Convection
摘要
The removal of excess heat generated from electronic device is desirable for its safe and consistent operation. The present study was made to investigate the influence of proposed stepped fin configurations on heat transfer augmentation under natural convective environments using CFD simulations. Judicious selection of five different vertical fin arrangements on a horizontal base were used to study fin’s performance. The optimum value of inter fin spacing that augments heat transfer was determined first. For the obtained optimum number of fins, the comparison of results was made in terms of heat transfer rate, effectiveness, and Nusselt number. The outcomes of result reveal that the Case-V, alternate arrangement of stepped fin and inverted stepped fin with the mass same as that of continuous one improves the heat transfer rate by 19.2% in comparison to the continuous rectangular fins. The fin geometry under Case-V also improves both the Nusselt number and the fin effectiveness.