<p>For advanced automotive, aeronautical and space applications, conventional (C) electrochemical machining (ECM) is an established tool room process capable of machining hard/ductile/rigid conductive materials. Significant studies have been reported on the C-ECM, modified (M)-ECM with an inter-electrode slit (IES) employed for partial insulation of the cathode to improve the Material Removal Rate (MRR) and other surface characteristics. However, little has been reported on the effect of fixed partial cathode insulation by Thermoplastic Cathode Cap (TCC) on MRR. This study highlights the impact of TCC (as fixed partial cathode insulation) and IES (as floating partial cathode insulation) during M-ECM and C-ECM with Cu as tool and Monel-400 as workpiece (W/P) in terms of MRR and other surface characteristics. The result suggests that the M-ECM with TCC is better than IES and C-ECM for MRR and other surface characteristics. Overall, the best settings for MRR (133.98 × 10<sup>−5</sup>&#xa0;g/s) are the M-ECM process with TCC, voltage 21&#xa0;V, and a flow rate of 40%, resulting in average grain size number (AGS): 7, porosity (P): 11.38%, and surface roughness (Ra): 16.35&#xa0;µm.</p>

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On Machining Characteristics of Modified Electrochemical Machining with Fixed Thermoplastic Cathode Cap for Partial Insulation

  • Rupinder Singh,
  • Gurwinder Singh,
  • Arun Dutt Sharma,
  • Dixit Garg

摘要

For advanced automotive, aeronautical and space applications, conventional (C) electrochemical machining (ECM) is an established tool room process capable of machining hard/ductile/rigid conductive materials. Significant studies have been reported on the C-ECM, modified (M)-ECM with an inter-electrode slit (IES) employed for partial insulation of the cathode to improve the Material Removal Rate (MRR) and other surface characteristics. However, little has been reported on the effect of fixed partial cathode insulation by Thermoplastic Cathode Cap (TCC) on MRR. This study highlights the impact of TCC (as fixed partial cathode insulation) and IES (as floating partial cathode insulation) during M-ECM and C-ECM with Cu as tool and Monel-400 as workpiece (W/P) in terms of MRR and other surface characteristics. The result suggests that the M-ECM with TCC is better than IES and C-ECM for MRR and other surface characteristics. Overall, the best settings for MRR (133.98 × 10−5 g/s) are the M-ECM process with TCC, voltage 21 V, and a flow rate of 40%, resulting in average grain size number (AGS): 7, porosity (P): 11.38%, and surface roughness (Ra): 16.35 µm.