Physical and mechanical properties of low-density particleboards of Amazon jupati palm and pinewood

Low-density particleboards (LDP) with different levels of jupati particles (0%, 25%, 50%, 75%, and 100%) combined with Pinus oocarpa (pine wood) particles were produced with 10% urea–formaldehyde and a target density of 600 kg/m³. A complete characterization of jupati particles was carried out. Physical, mechanical, and microstructure tests have proven its performance in LDP. The characterization of jupati revealed excellent low density (120 kg/m³) and adequate extractive content (6.90%), that is, below 10% for LDP production. Water absorption and swelling of LDP thickness increased with increasing jupati levels. The mechanical properties of all jupati-containing LDP were reduced compared to 100% pine wood particleboards but met standardized requirements. Thermal conductivities were similar among all particleboards, but 100% jupati particleboard panels presented superior acoustic insulation. Alone or combined with pine wood, jupati can maintain or improve the thermal and acoustic insulation of the LDP, maintaining adequate mechanical resistance.