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<p>In this study, we present and discuss the effects of 3, 5, and 7&#xa0;wt.% Si addition on the solidification thermal parameters of α-Al phase formation, morphology/microstructural spacing, and microhardness in a base of Al–0.25&#xa0;wt.% Si alloy. The solidification parameters were determined using the Thermo-Calc software. A data acquisition system recorded the slow cooling curves for the thermal analysis. Slow cooling curves analysis showed that silicon solute additions changed the solidification parameters, such as temperature of nucleation, minimum temperature, and growth. Nucleation temperatures decreased, when silicon solute was added. High amounts of silicon solute altered the morphology of the as-cast microstructure, from cellular in the base alloy with 0.25&#xa0;wt.% Si to dendritic morphology for aluminum alloys containing 3, 5, and 7&#xa0;wt.% Si. The results of the thermal analysis revealed lower recalescence temperatures with silicon solute addition, and these alterations led to a reduction in the microstructural spacings. Decreasing the recalescence temperature had a positive influence on the spacing of the as-cast microstructure, which reflected directly on the its microhardness. These thermal parameters of solidification and silicon additions were key factors acting in parallel during the solidification experiments of hypoeutectic aluminum alloys, favoring the microhardness. It stood out among results the influence of silicon content, microstructural spacing and eutectic formation on as-cast alloys properties. The as-cast alloys with refined microstructures, higher silicon contents, and an increase in the fraction of eutectic regions favored the resulting microhardness.</p>

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Cooling Curve Evaluation in Base Al–Si Alloys: Effects of Silicon Additions on the Thermal Parameters, Microstructural Patterns, and Microhardness

  • 期刊论文

  • 发表日期：

    2025年2月10日

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  • Alexandre Furtado Ferreira,
  • Franciele de Matos Peixoto,
  • Alan Granadeiro Torres,
  • Carolina Moreira de Almeida,
  • Matheus Carvalho Nascimento,
  • Leonardo de Olivé Ferreira

摘要

In this study, we present and discuss the effects of 3, 5, and 7 wt.% Si addition on the solidification thermal parameters of α-Al phase formation, morphology/microstructural spacing, and microhardness in a base of Al–0.25 wt.% Si alloy. The solidification parameters were determined using the Thermo-Calc software. A data acquisition system recorded the slow cooling curves for the thermal analysis. Slow cooling curves analysis showed that silicon solute additions changed the solidification parameters, such as temperature of nucleation, minimum temperature, and growth. Nucleation temperatures decreased, when silicon solute was added. High amounts of silicon solute altered the morphology of the as-cast microstructure, from cellular in the base alloy with 0.25 wt.% Si to dendritic morphology for aluminum alloys containing 3, 5, and 7 wt.% Si. The results of the thermal analysis revealed lower recalescence temperatures with silicon solute addition, and these alterations led to a reduction in the microstructural spacings. Decreasing the recalescence temperature had a positive influence on the spacing of the as-cast microstructure, which reflected directly on the its microhardness. These thermal parameters of solidification and silicon additions were key factors acting in parallel during the solidification experiments of hypoeutectic aluminum alloys, favoring the microhardness. It stood out among results the influence of silicon content, microstructural spacing and eutectic formation on as-cast alloys properties. The as-cast alloys with refined microstructures, higher silicon contents, and an increase in the fraction of eutectic regions favored the resulting microhardness.