Scholarlink

<p>As the paradigm of modern medicine shifts toward prevention and management, the importance of implantable electronics for real-time physiological monitoring and therapeutic intervention has surged, yet the mechanical mismatch between conventional rigid devices and soft tissues poses significant challenges regarding inflammation and long-term performance. Consequently, this review hierarchically analyzes advanced semiconductor integration strategies for flexible and stretchable implantable systems, utilizing Silicon Nanomembrane (SiNM) technology as a core building block to achieve mechanical compliance while maintaining CMOS compatibility. We systematically examine flexible substrate processing and patterning techniques, including laser-induced graphene (LIG) and printing methods, and place special emphasis on conformal encapsulation strategies using inorganic/organic multilayer thin films to ensure miniaturization and reliability in harsh biological environments. Furthermore, the review covers system-level integration issues, including hierarchical wireless communication strategies tailored to implantation depth and hybrid energy harvesting technologies for battery-free operation, ultimately proposing that the organic integration of these elements is essential for realizing next-generation "Fully Autonomous Bio-integrated Systems".</p>

错误：搜索内容不能为空，请输入英文关键词
错误：关键词超出字数限制，请精简
高级检索

Advanced silicon nanomembrane based bioelectronics for flexible and stretchable implantable systems

  • 期刊论文

  • 发表日期：

    2026年3月24日

查看全文
  • Junseok Lee,
  • Yena Lee,
  • Hanbi Woo,
  • Minji Hong,
  • Doohyun J. Lee,
  • Mingyu Sang

摘要

As the paradigm of modern medicine shifts toward prevention and management, the importance of implantable electronics for real-time physiological monitoring and therapeutic intervention has surged, yet the mechanical mismatch between conventional rigid devices and soft tissues poses significant challenges regarding inflammation and long-term performance. Consequently, this review hierarchically analyzes advanced semiconductor integration strategies for flexible and stretchable implantable systems, utilizing Silicon Nanomembrane (SiNM) technology as a core building block to achieve mechanical compliance while maintaining CMOS compatibility. We systematically examine flexible substrate processing and patterning techniques, including laser-induced graphene (LIG) and printing methods, and place special emphasis on conformal encapsulation strategies using inorganic/organic multilayer thin films to ensure miniaturization and reliability in harsh biological environments. Furthermore, the review covers system-level integration issues, including hierarchical wireless communication strategies tailored to implantation depth and hybrid energy harvesting technologies for battery-free operation, ultimately proposing that the organic integration of these elements is essential for realizing next-generation "Fully Autonomous Bio-integrated Systems".