<p>Micro-transfer printing (μTP) technology, which relies on tunable and reversible adhesives interfaces, enables precise integration of microscale devices onto heterogeneous substrates for advanced electronic and photonic applications. Shape memory polymers (SMPs) have emerged as promising stamp materials for µTP since their adhesion strength can be reversibly and easily tuned through thermal activation. Although composition is a key parameter governing the mechanical and adhesion properties of SMPs, the influence of composition ratio between major components has been rarely investigated, particularly in relation to the pick-up and release behavior of microscale devices. Here, we present an investigation of the composition-dependent pick-up and release characteristics of SMP stamps. Three SMPs with varying stearyl acrylate (SA) and urethane diacrylate ratios were synthesized and evaluated both theoretically and experimentally, revealing that SA-rich compositions exhibit superior adhesion contrast and μTP performance. By applying the optimized SMP stamp to the transfer of micro-light emitting diodes, we experimentally demonstrate robust and repeatable device transfer. Our findings pave the way for reliable heterogeneous integration of next-generation microscale electronic and photonic devices.</p> Graphical Abstract <p></p>

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Composition-Engineered Shape Memory Polymer Stamps for Robust Micro-Transfer Printing of µLEDs

  • Mingi Chai,
  • Hyun Tak,
  • Youngmin Kim

摘要

Micro-transfer printing (μTP) technology, which relies on tunable and reversible adhesives interfaces, enables precise integration of microscale devices onto heterogeneous substrates for advanced electronic and photonic applications. Shape memory polymers (SMPs) have emerged as promising stamp materials for µTP since their adhesion strength can be reversibly and easily tuned through thermal activation. Although composition is a key parameter governing the mechanical and adhesion properties of SMPs, the influence of composition ratio between major components has been rarely investigated, particularly in relation to the pick-up and release behavior of microscale devices. Here, we present an investigation of the composition-dependent pick-up and release characteristics of SMP stamps. Three SMPs with varying stearyl acrylate (SA) and urethane diacrylate ratios were synthesized and evaluated both theoretically and experimentally, revealing that SA-rich compositions exhibit superior adhesion contrast and μTP performance. By applying the optimized SMP stamp to the transfer of micro-light emitting diodes, we experimentally demonstrate robust and repeatable device transfer. Our findings pave the way for reliable heterogeneous integration of next-generation microscale electronic and photonic devices.

Graphical Abstract