Research on In-Situ Grown Graphene-Like Coated Copper Powder and Its Conductive Paste
摘要
This study investigates the in-situ growth of graphene-like coated copper powder and its application in conductive pastes, with the aim of addressing the issue of reduced conductivity caused by copper powder oxidation in low-temperature cured electronic pastes, thereby improving the stability and long-term performance of the conductive paste. A graphene-like coating is synthesized on the surface of copper powder using an ascorbic acid-based method, followed by pyrolysis, significantly enhancing its oxidation resistance and electrical conductivity. The effects of process parameters—such as ascorbic acid dosage, pyrolysis temperature, and pyrolysis time—on the formation of the graphene-like coating were systematically studied. The structure and morphology of the coated copper powder were characterized using Raman spectroscopy, X-ray photoelectron spectroscopy (XPS), and scanning electron microscopy (SEM), while its electrical conductivity was evaluated through resistivity measurements. The results indicate that a stable graphene-like coating can be in-situ formed on the copper powder surface when the ascorbic acid dosage is 5–10 times the theoretical minimum, the pyrolysis temperature is maintained at 400–450 °C, and the pyrolysis duration is 120 min, resulting in significantly lower resistivity compared to the uncoated copper powder. Further studies explored the application of the graphene-like coated copper powder in low-temperature cured conductive pastes, and its performance was compared to that of the original copper powder in paste preparation. Testing and analysis of the paste’s rheological behavior, printability, and electrical performance revealed that the graphene-like coated copper powder paste exhibits superior shear-thinning characteristics, printing uniformity, and conductivity stability when compared to the original copper powder paste. The experimental findings demonstrate that this coating technology significantly enhances the oxidation resistance and conductivity of copper powder, offering a promising material alternative for the development of low-temperature cured conductive pastes.
Graphical Abstract