Microstructure, Mechanical Properties and Thermal Conductivity of Al-RE-xSi Alloys
摘要
This study investigates the effects of Si content on the microstructure, mechanical properties and thermal conductivity of Al-1MM (Misch Metal) alloys. The phase transformation during solidification was analyzed using Pandat software, and the microstructure was examined through SEM and EDS. Fluidity tests were conducted to evaluate castability, while electrical and thermal conductivity were measured for both as-cast and extruded conditions. The results show that increasing Si content in Al-1MM alloys leads to the formation of finer intermetallic compounds and eutectic structures compared to commercial ADC12 alloy. The addition of MM improves electrical and thermal conductivity by forming intermetallic compounds with Si. While tensile strength increases with Si content, elongation decreases. Al-1MM-xSi alloys exhibit significantly higher ductility compared to ADC12 alloy.
Graphical Abstract