Simulation and Analysis of Molybdenum Tungsten Impact on Capacitive MEMS Pressure Sensor

This paper utilizes COMSOL software to conduct comprehensive simulations and analyses to evaluate the Micro-Electro-Mechanical System (MEMS) capacitive pressure sensor’s performance with and without packaging. The study evaluates the influence of the compatibility of material physical properties, focusing on molybdenum and tungsten. The evaluation parameters include linearity, capacitance sensitivity, and resilience to temperature variations. Molybdenum and tungsten demonstrate promising results, exhibiting high linearity with a nonlinear correlation factor of 0.9999 with packaging and 0.9984 without packaging in the 0–20 kPa pressure range, without the need for mechanical or electrical compensations. The molybdenum-tungsten sensor has exceptional resistance to capacitance variations, with only a 0.08511 pF alteration across a 263–773 K temperature span. To validate these findings, a case study has been incorporated to confirm the impact of matching and a high Young’s modulus in attaining linearity. These discoveries highlight the potential of capacitive MEMS pressure sensors based on molybdenum and tungsten for consistent and stable performance in various operating conditions.