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<p>Tween (TW) compounds, on account of their environmentally benign and non-toxic characteristics, were systematically studied as prospective eco-friendly suppressants in the process of copper plating for blind hole filling. The synergistic effects between TW and other additives were verified by means of chronopotentiometry, cyclic voltammetry, and electrochemical impedance spectroscopy. The outcomes of the electrochemical tests revealed that the competitive adsorption behavior between bis-(3-sulfopropyl) disulfide (SPS) and TW is contingent upon the current density and the intensity of convection. Metallographic section analysis demonstrated that TW exhibits outstanding microvia filling capabilities for micro blind vias with a diameter of 150&#xa0;µm and a depth of 80&#xa0;µm. Notably, TW-80 was able to attain a filling rate of 96.15% following electrodeposition for 60&#xa0;min at a current density of 2 A/dm<sup>2</sup>. Quantum chemical calculations suggested that the relatively smaller band gap and the clustered molecular structure of TW-80 are more conducive to its adsorption onto the electrode surface, leading to the formation of a barrier layer, which in turn restrains the deposition of copper.</p> Graphical Abstract <p></p>

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Tween Compounds as Eco-Friendly Suppressors for Acid Copper Electroplating Applications of Microvia

  • 期刊论文

  • 发表日期：

    2025年5月17日

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  • Zewei Lin,
  • Zhihua Tao,
  • Yuxuan Huang,
  • Jihua Zhang

摘要

Tween (TW) compounds, on account of their environmentally benign and non-toxic characteristics, were systematically studied as prospective eco-friendly suppressants in the process of copper plating for blind hole filling. The synergistic effects between TW and other additives were verified by means of chronopotentiometry, cyclic voltammetry, and electrochemical impedance spectroscopy. The outcomes of the electrochemical tests revealed that the competitive adsorption behavior between bis-(3-sulfopropyl) disulfide (SPS) and TW is contingent upon the current density and the intensity of convection. Metallographic section analysis demonstrated that TW exhibits outstanding microvia filling capabilities for micro blind vias with a diameter of 150 µm and a depth of 80 µm. Notably, TW-80 was able to attain a filling rate of 96.15% following electrodeposition for 60 min at a current density of 2 A/dm2. Quantum chemical calculations suggested that the relatively smaller band gap and the clustered molecular structure of TW-80 are more conducive to its adsorption onto the electrode surface, leading to the formation of a barrier layer, which in turn restrains the deposition of copper.

Graphical Abstract