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<p>This paper deals with the development of sound joints of P92 steel and 316L austenitic stainless steel (AISI 316L) via a solid state joining method named vacuum diffusion bonding and its characterization concerning metallurgical, mechanical, and high temperature creep-rupture behavior. Metallurgical characterization of the interface was done using FE-SEM, EPMA, and XRD. The bonds were developed at 1000&#xa0;°C, 20&#xa0;MPa, and 60&#xa0;min of holding time. During tensile testing the strength of the bond was found to be 652&#xa0;MPa and specimens failed from the AISI 316L side base metal. The diffusion bond also possesses a good V-notch Charpy impact toughness of 108 J. Additionally, creep experiments with a stress range of 120 to 160&#xa0;MPa were performed at 620&#xa0;°C. The surface studies of the creep deformed specimens were also performed using FE-SEM. Creep testing of the diffusion bonds showed the failure from the diffusion bond interface due to pore formation, as the interlinking of these pores leads to crack formation resulting in fracture.</p>

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Bond Interface Analysis and Creep Behavior of Vacuum Diffusion Bonded P92 Steel and 316L Austenitic Stainless Steel

  • 期刊论文

  • 发表日期：

    2025年1月24日

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  • Gaurav Sharma,
  • Dheerendra Kumar Dwivedi,
  • Pratishtha Sharma

摘要

This paper deals with the development of sound joints of P92 steel and 316L austenitic stainless steel (AISI 316L) via a solid state joining method named vacuum diffusion bonding and its characterization concerning metallurgical, mechanical, and high temperature creep-rupture behavior. Metallurgical characterization of the interface was done using FE-SEM, EPMA, and XRD. The bonds were developed at 1000 °C, 20 MPa, and 60 min of holding time. During tensile testing the strength of the bond was found to be 652 MPa and specimens failed from the AISI 316L side base metal. The diffusion bond also possesses a good V-notch Charpy impact toughness of 108 J. Additionally, creep experiments with a stress range of 120 to 160 MPa were performed at 620 °C. The surface studies of the creep deformed specimens were also performed using FE-SEM. Creep testing of the diffusion bonds showed the failure from the diffusion bond interface due to pore formation, as the interlinking of these pores leads to crack formation resulting in fracture.