Characterizing the Microstructure, Grain Refinement, Electromagnetic Shielding Feature, and Hardness of Copper/Aluminum Multilayered Composites for automobile applications
摘要
In the current study, the Al matrix and Cu matrix composites were fabricated by seven cycles of accumulative roll bonding at room temperature. By increasing the cycles and number of layers, the reinforcing layers were better fragmented and distributed in the matrix. Also, the grain structure of the Al and Cu layers was refined after seven cycles. The average grain size of Al and Cu reached 0.9 µm and 1.2 µm, respectively, after the seventh cycle. By increasing the number of layers, the average grain size in the Al and Cu layers increased and reached 4.5 µm and 4.3 µm, respectively. Furthermore, the microhardness values showed an increase versus cycles. The maximum values reached 74 HV and 200 HV for Al and Cu after the seven cycles. However, the increase in the number of layers had an adverse impact on hardness values. The electromagnetic shielding and gamma-ray attenuation of composites improved versus cycles and number of layers. The maximum values of electromagnetic shielding in Al matrix and Cu matrix composites were 45 dB and 51.5 dB, respectively, after seven cycles. Also, the maximum values of gamma-ray attenuation in Al matrix and Cu matrix composites reached 0.078 cm2 g−1and 0.094 cm2 g−1, respectively.