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<p>The emergence of advanced chemical mechanical polishing (CMP) technologies has significantly increased the performance demands for silicon wafer polishing liquids. Hydroxyethyl cellulose (HEC), a cost-effective and environmentally friendly water-soluble polymer, enhances the hydrophilicity of silicon wafer surfaces. Hydroxyethyl cellulose (HEC) effectively lowers haze levels in silicon wafers after final polishing. This study examines how hydroxyethyl cellulose (HEC) of different molecular weights improves silicon wafer hydrophilicity and alters surface texture. At a hydroxyethyl cellulose (HEC) molecular weight of 1,250,000, the water contact angle on silicon wafers decreased by 43.3%. However, higher HEC molecular weights reduced polishing solution dispersibility, potentially causing silica agglomeration and compromising performance. Polyvinylpyrrolidone (PVP) addition improved dispersion stability while enhancing polishing solution performance, resulting in better silicon wafer surface quality. The HEC-PVP combination reduced the water contact angle by 73.5% and surface roughness by 92%, demonstrating excellent surface modification effectiveness. Comprehensive analysis using XPS, zeta potential analysis, and electrochemical measurements confirmed the synergistic effect of HEC-PVP on silicon wafer surfaces.</p>

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Study on the Synergistic Effect of Water-soluble Polymers on the Surface Properties of Silicon Wafers

  • 期刊论文

  • 发表日期：

    2026年1月7日

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  • Peng Zhao,
  • Yulin Chen,
  • Jige Wang,
  • Zhiyuan Zhao,
  • Meng Yang,
  • Zefang Zhang

摘要

The emergence of advanced chemical mechanical polishing (CMP) technologies has significantly increased the performance demands for silicon wafer polishing liquids. Hydroxyethyl cellulose (HEC), a cost-effective and environmentally friendly water-soluble polymer, enhances the hydrophilicity of silicon wafer surfaces. Hydroxyethyl cellulose (HEC) effectively lowers haze levels in silicon wafers after final polishing. This study examines how hydroxyethyl cellulose (HEC) of different molecular weights improves silicon wafer hydrophilicity and alters surface texture. At a hydroxyethyl cellulose (HEC) molecular weight of 1,250,000, the water contact angle on silicon wafers decreased by 43.3%. However, higher HEC molecular weights reduced polishing solution dispersibility, potentially causing silica agglomeration and compromising performance. Polyvinylpyrrolidone (PVP) addition improved dispersion stability while enhancing polishing solution performance, resulting in better silicon wafer surface quality. The HEC-PVP combination reduced the water contact angle by 73.5% and surface roughness by 92%, demonstrating excellent surface modification effectiveness. Comprehensive analysis using XPS, zeta potential analysis, and electrochemical measurements confirmed the synergistic effect of HEC-PVP on silicon wafer surfaces.