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Preparation of a New Single Component Silicone Resin and Its Application in Impregnating Varnish

  • Jin-Hui Li,
  • Dan Peng,
  • Qiu-Hong Mou,
  • Feng Wang,
  • Yun-Qiao Ding

摘要

In this paper, a new single component silicone resin with D-T structural components was prepared through two condensation processes. The design of the silicone resin structure is based on computational simulation by B3LYP functional method with the 6-31G (d) level. A new class- C insulating solvent-free silicone impregnating varnish based the new single component silicone resin was prepared. The solvent-free varnish can be cured under the influence of heat and platinum catalysis. We tested the viscosity-temperature characteristic of the impregnating varnish. We observed the stability of the impregnating varnish under different temperature. We analyzed the curing characteristics of the impregnating varnish by DSC and Moving Die Rheometer. The curing process of the impregnating varnish is determined as follow: first curing stage for 22 h at 190℃, and then the second curing stage for 2 h at 200℃.