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<p>Aerosol Jet Printing (AJP) holds significant potential in flexible electronics manufacturing, yet its industrialization is hindered by performance fluctuations caused by the sensitivity of process parameters. To overcome this bottleneck, this study moves beyond the traditional single-parameter optimization paradigm and proposes a multi-objective optimization framework integrating a Visual Consistency Grade (VCG) as a comprehensive quality metric. By combining an L16 orthogonal array with Response Surface Methodology (RSM), the synergistic effects of printing speed, coverage, path pattern, and number of layers on electrical performance and morphological quality were systematically analyzed and quantified. This research clearly reveals, for the first time, that printing speed is the dominant variable governing resistance, while a novel serpentine chamfered path is key to achieving high geometric fidelity. Ultimately, this study not only precisely identifies the optimal process window but also provides a widely applicable optimization methodology, significantly enhancing the robustness and predictability of AJP. This paves the way for its scalable application in precision flexible electronics manufacturing.</p>

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Optimization of Aerosol Printing Parameters Via Experiments of Balancing Conductivity and Geometric Fidelity in Flexible Electronics

  • 期刊论文

  • 发表日期：

    2026年2月11日

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  • Pengfei Li,
  • Shuangjie Liu,
  • Hui Zhang

摘要

Aerosol Jet Printing (AJP) holds significant potential in flexible electronics manufacturing, yet its industrialization is hindered by performance fluctuations caused by the sensitivity of process parameters. To overcome this bottleneck, this study moves beyond the traditional single-parameter optimization paradigm and proposes a multi-objective optimization framework integrating a Visual Consistency Grade (VCG) as a comprehensive quality metric. By combining an L16 orthogonal array with Response Surface Methodology (RSM), the synergistic effects of printing speed, coverage, path pattern, and number of layers on electrical performance and morphological quality were systematically analyzed and quantified. This research clearly reveals, for the first time, that printing speed is the dominant variable governing resistance, while a novel serpentine chamfered path is key to achieving high geometric fidelity. Ultimately, this study not only precisely identifies the optimal process window but also provides a widely applicable optimization methodology, significantly enhancing the robustness and predictability of AJP. This paves the way for its scalable application in precision flexible electronics manufacturing.