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<p>Lab-on-PCB (Printed Circuit Board) systems represent a class of microfluidic devices integrated into PCBs, facilitating the miniaturization and automation of laboratory operations such as chemical analysis, diagnostics, and biological sample handling. In particular, in Lab-on-PCB devices designed for nanomaterial synthesis, the PCB heater plays a critical role in maintaining precise control over chemical reaction temperatures. However, conventional approaches face challenges in accurately measuring surface temperatures. To overcome this limitation, we propose a numerical simulation approach to predict temperature distribution across the PCB substrate, the glass substrate, and the upper surface of the PDMS layer. The simulated temperature data for the upper PDMS surface was validated against experimental measurements, demonstrating strong agreement. This validation enabled the estimation of the temperature within the microchannel, which corresponds to the reaction conditions in microreactors. Results indicate that errors below 1% within 5&#xa0;mm around the heating center and below 2% within 5–30&#xa0;mm. This high level of correlation underscores the reliability of the simulation as an efficient alternative to traditional methods, eliminating the need for complex thermal sensor systems while maintaining accuracy in temperature determination.</p>

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Investigation of Thermal Distribution in Lab-on-PCB Device for Nanosynthesis

  • 期刊论文

  • 发表日期：

    2025年7月23日

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  • Xuan Luc Le,
  • Tuan Quoc Vu,
  • Van Hoa Phi,
  • Nhat Van Pham

摘要

Lab-on-PCB (Printed Circuit Board) systems represent a class of microfluidic devices integrated into PCBs, facilitating the miniaturization and automation of laboratory operations such as chemical analysis, diagnostics, and biological sample handling. In particular, in Lab-on-PCB devices designed for nanomaterial synthesis, the PCB heater plays a critical role in maintaining precise control over chemical reaction temperatures. However, conventional approaches face challenges in accurately measuring surface temperatures. To overcome this limitation, we propose a numerical simulation approach to predict temperature distribution across the PCB substrate, the glass substrate, and the upper surface of the PDMS layer. The simulated temperature data for the upper PDMS surface was validated against experimental measurements, demonstrating strong agreement. This validation enabled the estimation of the temperature within the microchannel, which corresponds to the reaction conditions in microreactors. Results indicate that errors below 1% within 5 mm around the heating center and below 2% within 5–30 mm. This high level of correlation underscores the reliability of the simulation as an efficient alternative to traditional methods, eliminating the need for complex thermal sensor systems while maintaining accuracy in temperature determination.