<p>Ni/Ag–Si and Ni/Ag–SiC multilayer coatings were produced on copper substrates using direct current (DC) and pulse reverse current (PRC) electrodeposition. The PRC process significantly refined the microstructure and resulted in denser and finer grains, while the corrosion current density was reduced by almost 50% compared to DC deposition. The incorporation of SiC nanoparticles further improved the surface quality by reducing roughness and increasing wettability, resulting in stable hydrophobicity with contact angles of over 115° in chloride-containing media. In addition, the PRC + SiC coatings showed better resistance to tarnishing in sulphur-containing environments, indicating a longer duration of protection. These improvements are due to the synergistic effects of pulse reversal nucleation dynamics and nanoparticle reinforcement, which together improve the integrity of the barrier and the functionality of the surface. The results demonstrate a versatile electrodeposition strategy for the development of durable, multifunctional coatings with potential applications in jewellery, biomedical devices, and electronic components.</p> Graphical abstract <p></p>