<p>The precise evaluation of residual stresses at the microscale is increasingly recognized as pivotal for enhancing the performance and reliability of advanced engineering materials. This review provides a critical and comprehensive synthesis of recent progress in the application of Focused Ion Beam-Digital Image Correlation (FIB-DIC) methodologies for microscale residual stress characterization across diverse scenarios, including material classes, complex structures, heterogeneous phases, and manufacturing processes. By systematically categorizing the literature according to material classes and application scenarios, this review elucidates key technological advancements and methodological innovations that have enabled sub-micron spatial resolution in stress mapping. Particular attention is given to recent developments in micro ring-core milling strategies, stress gradient profiling, and depth-resolved analysis. Persistent challenges, including ion beam-induced damage, inaccurate DIC tracking, and sample preparation effects, are critically examined. Finally, the review outlines prospective research directions aimed at further improving measurement accuracy and expanding the applicability of FIB-DIC techniques to complex geometries and emerging materials.</p> Graphical Abstract <p></p>